Open Access. Powered by Scholars. Published by Universities.®
- Institution
- Keyword
-
- 3-D integration (1)
- Artificial Intelligence (AI) (1)
- Band-pass filter (1)
- Benefits of AI (1)
- Bias in AI Systems (1)
-
- Conceptual Investigation (1)
- Databases (1)
- Deep Learning (1)
- Embedded Systems (1)
- Ethical Considerations (1)
- Future AI (1)
- Human-AI Interaction (1)
- Human-Machine Interaction (1)
- Integrated passive device (1)
- Internet of Things (1)
- IoT (1)
- Job Displacement (1)
- Machine Learning (1)
- Metamophosis (1)
- Natural Language Processing (1)
- Networking (1)
- Passive components -- Design and construction (1)
- Quantum Computing (1)
- Risks of AI (1)
- Robotics (1)
- SWOT (1)
- Strip transmission lines (1)
- Surface mount technology (1)
- Through glass via inductor (1)
- Web Development (1)
- Publication
- Publication Type
Articles 1 - 6 of 6
Full-Text Articles in Digital Circuits
Developing A Framework For Microchip Design Recovery, Eric Diep
Developing A Framework For Microchip Design Recovery, Eric Diep
Graduate Theses and Dissertations (2019 - present)
Due to the increase in diverse chip production over the past decade, reverse engineering has become a difficult and daunting task. This research develops a methodology for microchip design recovery, seeking to validate and reproduce prior approaches to physical reverse engineering using low-cost tools and techniques. We used mechanical hardware abrasion tools and techniques to delayer and capture silicon integrated chip (IC) layout. We focused on the Mifare Classic EVl microchip, commonly implemented in public transit/transportation cards, to extract information for design recovery. The research explores limitations and advantages of mechanical abrasion and optical microscopy in context to modem chip …
Remote Side-Channel Disassembly On Field-Programmable Gate Arrays, Brandon R. Baggett
Remote Side-Channel Disassembly On Field-Programmable Gate Arrays, Brandon R. Baggett
Graduate Theses and Dissertations (2019 - present)
Over the last two decades, side-channel vulnerabilities have shown to be a major threat to embedded devices. Most side-channel research has developed our understanding of the vulnerabilities to cryptographic devices due to their implementation and how we can protect them. However, side-channel leakage can yield useful information about many other processes that run on the device. One promising area that has received little attention is the side-channel leakage due to the execution of assembly instructions. There has been some work in this area that has demonstrated the idea’s potential, but so far, this research has assumed the adversary has physical …
Chatgpt As Metamorphosis Designer For The Future Of Artificial Intelligence (Ai): A Conceptual Investigation, Amarjit Kumar Singh (Library Assistant), Dr. Pankaj Mathur (Deputy Librarian)
Chatgpt As Metamorphosis Designer For The Future Of Artificial Intelligence (Ai): A Conceptual Investigation, Amarjit Kumar Singh (Library Assistant), Dr. Pankaj Mathur (Deputy Librarian)
Library Philosophy and Practice (e-journal)
Abstract
Purpose: The purpose of this research paper is to explore ChatGPT’s potential as an innovative designer tool for the future development of artificial intelligence. Specifically, this conceptual investigation aims to analyze ChatGPT’s capabilities as a tool for designing and developing near about human intelligent systems for futuristic used and developed in the field of Artificial Intelligence (AI). Also with the helps of this paper, researchers are analyzed the strengths and weaknesses of ChatGPT as a tool, and identify possible areas for improvement in its development and implementation. This investigation focused on the various features and functions of ChatGPT that …
Investigating On Through Glass Via Based Rf Passives For 3-D Integration, Libo Qian, Jifei Sang, Yinshui Xia, Jian Wang, Peiyi Zhao
Investigating On Through Glass Via Based Rf Passives For 3-D Integration, Libo Qian, Jifei Sang, Yinshui Xia, Jian Wang, Peiyi Zhao
Mathematics, Physics, and Computer Science Faculty Articles and Research
Due to low dielectric loss and low cost, glass is developed as a promising material for advanced interposers in 2.5-D and 3-D integration. In this paper, through glass vias (TGVs) are used to implement inductors for minimal footprint and large quality factor. Based on the proposed physical structure, the impact of various process and design parameters on the electrical characteristics of TGV inductors is investigated with 3-D electromagnetic simulator HFSS. It is observed that TGV inductors have identical inductance and larger quality factor in comparison with their through silicon via counterparts. Using TGV inductors and parallel plate capacitors, a compact …
Musictrakr, Benjamin Lin
Musictrakr, Benjamin Lin
Computer Engineering
MusicTrackr is an IoT device that musicians attach to their instruments. The device has a start and stop button that allows users to record their playing sessions. Each recorded session is sent wirelessly to a cloud database. An accompanying website displays all of the recorded sessions, organized by date. After picking a specific date, the user can view graphs showing total practice time and average session length as well play back any recordings during that date. In addition, the user may add comments to any specific date or recording. Lastly, the user may tag a specific date with a color …
Measurement And Modeling Of Passive Surface Mount Devices On Fr4 Substrates, Rahulkumar Sadanand Koche
Measurement And Modeling Of Passive Surface Mount Devices On Fr4 Substrates, Rahulkumar Sadanand Koche
Dissertations and Theses
Passive components like resistors, capacitors and inductors are used in every electronic system. These are the very basic components which affect the system performance at higher frequencies and it is necessary to understand and model the behavior of these components in a very accurate manner. This work focuses on utilizing Printed Circuit Board (PCB) test boards, or fixtures, made of FR4 for characterizing Surface Mount Device (SMD) components. Agilent's Advanced Design System (ADS) microwave circuit simulation software was used for designing the microstrip transmission lines as well as for generating the layout for manufacturing of the PCB. SMD resistors, capacitors …