Physical Chemistry Commons^™

Influences Of Suppressing Additive Malachite Green On Superconformal Cobalt Filling And Nucleation, Xiao-Chuan Ma, Ya-Qiang Li, Pei-Xia Yang, Jin-Qiu Zhang, Mao-Zhong An

Journal of Electrochemistry

As the semiconductor integrated circuits evolve into 7 nm technology and beyond, the resistance of the Cu filling at back-end-of-line interconnects no longer linearly scales with dimension. The metal Co with lower mean free path can be used to replace Cu for reducing the line resistance caused by the scattering on the outer surface and grain boundary in the smaller and smaller size. In this study, CoSO₄ was used as the main salt, boric acid as a buffer and malachite green (MG) as an inhibitor for further research. According to the electrochemical cyclic voltammetric (CV) curves by using a …