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Research Of 2,2′-Dipyridine On Electroless Copper Plating Using Sodium Hypophosphite As Reductant, Bin Yang, Fang-Zu Yang, Ling Huang, Shu-Kai Xu, Guang-Hua Yao, Shao-Min Zhou

Journal of Electrochemistry

In the bath of the electroless copper plating using sodium hypophosphite as reductant,the effects of 2,2′-dipyridine on the deposition rate,anodic oxidation of sodium hypophosphite,cathodic reduction of copper ions,surface morphologies,structure and the existing status of the deposit components were examined.The results showed that,2,2′-dipyridine hindered the electroless deposition.Experiments of liner sweep voltammetry(LSV) indicated that,as the addition of 2,2′-dipyridine to the electrolyte,the oxidation peak potential of sodium hypophosphite shifted to a more negative value but the peak current decreased;the reducing peak potential of copper ions moved to a more negative value whereas the peak current increased.Scanning electron microscope(SEM)、energy dispersive spectroscopy(EDS)、X-ray diffraction(XRD) and X-ray …