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Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering

A Computer-Based Economic Analysis For Manufacturing Process Selection, Manocher Djassemi Nov 2008

A Computer-Based Economic Analysis For Manufacturing Process Selection, Manocher Djassemi

Industrial Technology and Packaging

An important part of financial planning in product development is considering whether the capital expenditures meet volume and cost goals. A good business plan should provide investors with the implications of process selection on the company's bottom line. It is estimated that there are least 1000 manufacturing processes and sub-processes. Considering the number of process choices and quantity of cost data, an economic analysis for process selection may pose a challenge for decision makers. This paper provides an insight to Ashby’s cost modeling method for generating an estimate of unit product cost. The cost model provides a broad indicator for …


Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers Nov 2008

Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers

Industrial and Manufacturing Engineering

Mobile and handheld electronic devices are prone to being dropped. This drop event may result in failure of solder joints inside these devices. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD22-B111 to standardize the method of drop testing surface mount electronic components. However, there has been little study on the effects of additional mass on the board and rigidity of the board on drop test reliability. This paper examines the drop impact dynamic responses of the JEDEC JESD22-B111 board. Of interest are the effects of …


Board Level Failure Analysis Of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, Jianbiao Pan Nov 2008

Board Level Failure Analysis Of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, Jianbiao Pan

Industrial and Manufacturing Engineering

This paper presents the failure analysis results of board level drop tests. In this study, the test vehicle was designed according to the requirements of the Joint Electron Device Engineering Council (JEDEC) drop test board. The test vehicle was assembled with 15 chip scale packages (CSPs) each having 228 daisy-chained 0.5 mm pitch solder joints using Sn-3.0 wt% Ag-0.5 wt% Cu (SAC305) lead free solder. Assemblies were drop tested using three different peak accelerations of 900 G, 1500 G, 2900 G, with 0.7 ms, 0.5 ms, and 0.3 ms pulse durations, respectively. Scanning electron microscopy (SEM) with energy dispersive spectroscopy …


The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham Nov 2008

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequency of 60KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through design of experiment methodology for four different cases: 25.4 μm wire at 60 kHz, 25.4 μm wire at 120 kHz, 17.8 μm wire at 60 kHz, and 17.8 μm wire at 120 kHz. The integrity of wire bonds …


Work In Progress - Enhancing Student-Learning Through State-Of-The-Art Systems Level Design And Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, Lynne A. Slivovsky Oct 2008

Work In Progress - Enhancing Student-Learning Through State-Of-The-Art Systems Level Design And Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

The curriculum for undergraduate engineering programs is often partitioned into several courses that are taught in isolation followed by a single culminating senior design or capstone project experience. In the senior design class students being to synthesize the knowledge and skills that they acquired through the engineering curriculum. This paper presents lower and upper division course and curricular changes made to accommodate learning objectives that better prepare students for project-based learning. These learning experiences and skills include: systems level design, experience with state-of-the-art Computer Aided Design (CAD) tools, printed circuit board (PBC) design, design for manufacturability, electronics assembly, project management, …


Alternative Binder Carbide Tools For Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, Daniel Norgan Oct 2008

Alternative Binder Carbide Tools For Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, Daniel Norgan

Industrial and Manufacturing Engineering

This study examines the performance of a new class of wear-resistant but economical cutting tools produced by varying the binder composition of standard cemented carbide composites. By replacing some or all of the cobalt binder with rhenium and nickel-based superalloy, a stronger composite tool results, potentially capable of machining heat-resistant superalloys at significantly higher cutting speeds. Sample tools with alternative binder were produced and compared to standard tools bound with cobalt only. Turning experiments on Inconel 718 were run to evaluate wear resistance and tool life for several grades. The experimentation also examined the effects of varying the relative proportions …


Strategic Plan For Industrial And Management Systems Engineering, Paul Savory Aug 2008

Strategic Plan For Industrial And Management Systems Engineering, Paul Savory

Industrial and Management Systems Engineering: Reports

The role of this strategic plan is to map out a range of department goals, offer objectives for achieving each goal, and list potential strategies for meeting an objective. It also lists performance metrics for measuring progress for each goal. Each year, a subset of goals and objectives will be identified by the IMSE department as a priority for the coming year. Detailed metrics for measuring improvement for the department’s priorities areas will then be defined. The department committee to develop the plan consisted of Dr. Paul Savory (committee chair), Dr. Susan Hallbeck, and Dr. Erick Jones.


Randomly Generating Manufacturing Flow Line Models Using Mathematica, Paul Savory Jul 2008

Randomly Generating Manufacturing Flow Line Models Using Mathematica, Paul Savory

Department of Industrial and Management Systems Engineering: Faculty Publications

To test heuristic algorithms and techniques, researchers need numerous datasets so as to measure effectiveness and improve approaches. This paper discusses using Mathematica, a mathematical programming language, for randomly generating the specifications for manufacturing flow line models. Important issues include determining an arrival rate to a flow line, the number of flow line stations, the number of parallel servers for each production station, and specifying the service time distributions and their associated parameters. The paper concludes with a discussion on generating more general types of simulation models.


Enhancing Student Learning Through State-Of-The-Art Systems Level Design And Implementation: The Development Of A Lower Division Learning Module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, Albert Liddicoat Jun 2008

Enhancing Student Learning Through State-Of-The-Art Systems Level Design And Implementation: The Development Of A Lower Division Learning Module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, Albert Liddicoat

Industrial and Manufacturing Engineering

The Cal Poly/Allan Hancock team is developing a learning module that will allow all lower division engineering students to design, fabricate, assemble, and test an electronic system implemented on a printed circuit board (PCB). All the services necessary to perform this laboratory experiment will be provided with low-cost vendors available on the . The learning module is being developed so that it can be integrated into the existing electrical engineering lower division courses that are required by all engineering students. The laboratory learning module will use operational amplifiers (op amp), resistors, capacitors and other common electronic components to study the …


Curricular Enhancement To Support Project-Based Learning In Computer And Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, Lynne A. Slivovsky Jun 2008

Curricular Enhancement To Support Project-Based Learning In Computer And Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

Undergraduate computer and electrical engineering programs often partition the curriculum into several courses based on related topics taught in isolation. Students are expected to synthesize their knowledge in a senior design project. It is the authors’ experience that students often struggle during their senior design project since they have not gained the appropriate knowledge or mastered necessary skills needed to work on a significant or team-based engineering design project. Specifically, students need to be able to define system requirements, partition the design into subcomponents, design, build, test, and verify that the system requirements have been met. The authors have enhanced …


A Project-Based Electronics Manufacturing Laboratory Course For Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, Dominic Dal Bello Jun 2008

A Project-Based Electronics Manufacturing Laboratory Course For Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, Dominic Dal Bello

Industrial and Manufacturing Engineering

This paper presents a project-based laboratory course on electronics design and manufacturing. The goal of this course is to provide lower-division engineering students a hands-on experience involving actual printed circuit board (PCB) design, layout, fabrication, assembly, and testing. Through project-based learning, students not only learn technical skills in designing and manufacturing an electronic device, but also develop their project management and communication skills early in their course of study at the university. The course outline and examples of the student projects are presented in this paper as well as project evaluations and students’ feedback. This paper also presents the selection …


Techniques For Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin, Sema E. Alptekin Jun 2008

Techniques For Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin, Sema E. Alptekin

Industrial and Manufacturing Engineering

In this paper, we describe various techniques used to make Intuitionistic Fuzzy Logic Systems amenable to operating on applications with large numbers of inputs. A rule reduction technique known as Combs method is combined with an automated tuning process based on Particle Swarm Optimization. A second stage of tuning on rule weights results in improved performance and further reduction in the size of the rule-base. The entire process has been developed to operate within the Matlab software environment. The technique is tested against the Wisconsin Breast Cancer Database. The use of these tools shows great promise in significantly expanding the …


Drop Test Reliability Of Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger May 2008

Drop Test Reliability Of Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger

Industrial and Manufacturing Engineering

This paper presents the drop test reliability of 0.5 mm pitch lead-free chip scale packages (CSPs). Fifteen 0.5 mm pitch CSPs were assembled on a standard JEDEC drop reliability test board with Sn3.0Ag0.5Cu lead-free solder. Eight boards were edge-bonded with a UV-cured acrylic; eight boards were edge- bonded with a thermal-cured epoxy; and twelve boards were assembled without edge bonding. Half of the edge-bonded test boards were subjected to drop tests at a peak acceleration of 1500 G with a pulse duration of 0.5 ms, and the other half subjected to drop tests at a peak acceleration of 2900 G …


Six Dimensions Of Expertise: A More Comprehensive Definition Of Cognitive Expertise For Team Coordination, S K. Garrett, Barrett S. Caldwell, E C. Harris, M C. Gonzalez Mar 2008

Six Dimensions Of Expertise: A More Comprehensive Definition Of Cognitive Expertise For Team Coordination, S K. Garrett, Barrett S. Caldwell, E C. Harris, M C. Gonzalez

School of Industrial Engineering Faculty Publications

Looking at expertise from the vantage point of many knowledge domains allows the observations and resulting definitions to be useful across a broad range of subject areas. A stable set of definitions that work on a higher, more comprehensive level than the current literature offers is needed for an integrated description of expertise. A cohesive cross-domain definition and explanation of expertise can be used to optimise group interactions. Since group performance incorporates additional components of expertise that are not present in individual performance situations, these additional components must be examined in order to see a full picture of the successful …


Simulation-Based Verification Of Lean Improvement For Emergency Room Process, Nancy Khurma, Gheorghe M. Bacioiu, Zbigniew J. Pasek Jan 2008

Simulation-Based Verification Of Lean Improvement For Emergency Room Process, Nancy Khurma, Gheorghe M. Bacioiu, Zbigniew J. Pasek

Industrial and Manufacturing Systems Engineering Publications

One of the key challenges to health care access in Canadian hospitals is growing overcrowding of the Emergency Departments (EDs), leading to the medical personnel overload, and the excessive waiting times to receive proper care. These adverse effects directly impact the patient satisfaction levels, the ability of the medical professionals to attend promptly to patients' health issues, and generate unnecessary costs. Addressing the sources of waste and improving the process provides better care and higher patient satisfaction, as well as increases operational efficiency and the ability of the medical professionals to intervene on time. This paper describes an effort aimed …


How Do You Interpret A Confidence Interval?, Paul Savory Jan 2008

How Do You Interpret A Confidence Interval?, Paul Savory

Industrial and Management Systems Engineering: Instructional Materials

A confidence interval (CI) is an interval estimate of a population parameter. Instead of estimating the parameter by a single value, a point estimate, an interval likely to cover the parameter is developed. Many student incorrectly interpret the meaning of a confidence interval. This paper offers a quick overview of how to correctly interpret a confidence interval.


Why Divide By (N-1) For Sample Standard Deviation?, Paul Savory Jan 2008

Why Divide By (N-1) For Sample Standard Deviation?, Paul Savory

Industrial and Management Systems Engineering: Instructional Materials

In statistics, the sample standard deviation is a widely used measure of the variability or dispersion of a data set. The standard deviation of a data set is the square root of its variance. In calculating the sample standard deviation, the divisor is the number of samples in the data set minus one (n-1) rather than n. This often confuses students. This paper offers a quick overview of why the divisor is (n-1) for calculating the sample standard deviation.


From Automatic Identification And Data Capture (Aidc) To “Smart Business Process”: Preparing For A Pilot Integrating Rfid, S. F. Wamba, E. Lefebvre, Y. Bendavid, L.. A. Lefebvre Jan 2008

From Automatic Identification And Data Capture (Aidc) To “Smart Business Process”: Preparing For A Pilot Integrating Rfid, S. F. Wamba, E. Lefebvre, Y. Bendavid, L.. A. Lefebvre

Faculty of Informatics - Papers (Archive)

This paper examines the underlying logic behind the rules configured in a RFID middleware to support “smart business processes” in one retail supply chain. Through a detailed investigation of the underlying business processes, we will demonstrate how businesses rules can be defined, configured and refined in a RFID middleware. The results confirm that RFID technology is not a “Plug and Play” solution. RFID middleware configuration will require a high level of customization. Finally, this study allows the improvement of our understanding of the real potential of RFID technology in the supply chain context.


Measuring Agility Of Organizations - A Comprehensive Agility Measurement Tool (Camt), Ameya S. Erande, Alok K. Verma Jan 2008

Measuring Agility Of Organizations - A Comprehensive Agility Measurement Tool (Camt), Ameya S. Erande, Alok K. Verma

Engineering Technology Faculty Publications

Since "Agility" is ability to respond to unpredictable changes with quick response and profitability, it is not industry specific. This "not industry specific" nature of agility makes it hard to assess and measure it on a fixed scale. Measurement of agility of an enterprise has been a major topic of research since inception of agility in 1991. Though some methods have been developed to measure agility, they mainly remain tied to manufacturing industry. As agility is present in all the industries, comprehensive tool to measure it is a necessity in order to determine responsiveness of an enterprise to external turbulences. …