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Full-Text Articles in Nanoscience and Nanotechnology
Studies And Progresses On Hole Metallization In High-Density Interconnected Printed Circuit Boards, Zhao-Yun Wang, Lei Jin, Jia-Qiang Yang, Wei-Qing Li, Dong-Ping Zhan, Fang-Zu Yang, Shi-Gang Sun
Studies And Progresses On Hole Metallization In High-Density Interconnected Printed Circuit Boards, Zhao-Yun Wang, Lei Jin, Jia-Qiang Yang, Wei-Qing Li, Dong-Ping Zhan, Fang-Zu Yang, Shi-Gang Sun
Journal of Electrochemistry
Printed circuit boards (PCBs) are almost the core components of all electronic systems. With the rapid development of sciences and technologies, PCBs are gradually developing in the direction of multi-layer, thin and high-density wiring due to the functionalization, miniaturization, lightweight and high reliability of electronic products, as well as the widespread popularization of the subminiature package such as chip scale package (CSP) and ball grid array (BGA). Therefore, High-density interconnected printed circuit boards (HDI-PCBs) arise. Hole metallization is one of the core technologies in HDI-PCBs and includes two processes composed of conductive treatment and electron electroplating. Electroless copper plating, as …
Research Progresses Of Copper Interconnection In Chips, Lei Jin, Jia-Qiang Yang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian, Shao-Min Zhou
Research Progresses Of Copper Interconnection In Chips, Lei Jin, Jia-Qiang Yang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian, Shao-Min Zhou
Journal of Electrochemistry
In this paper, the copper interconnection technology in chip manufacturing is introduced in detail, and the essentials of acidic copper sulfate electroplating process and the mechanisms of common-used additives are reviewed. The progresses of novel additives at home and abroad are also summarized. Based on the studied achievement, the possibility of the novel copper interconnect process replacing the acidic copper electroplating is prospected.