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Full-Text Articles in Nanoscience and Nanotechnology
Direct Measurement Of Graphene Adhesion On Silicon Surface By Intercalation Of Nanoparticles, Zong Zong, Chia-Ling Chen, Mehmet R. Dokmeci, Kai-Tak Wan
Direct Measurement Of Graphene Adhesion On Silicon Surface By Intercalation Of Nanoparticles, Zong Zong, Chia-Ling Chen, Mehmet R. Dokmeci, Kai-Tak Wan
Kai-tak Wan
We report a technique to characterize adhesion of monolayered/multilayered graphene sheets on silicon wafer. Nanoparticles trapped at graphene-silicon interface act as point wedges to support axisymmetric blisters. Local adhesion strength is found by measuring the particle height and blister radius using a scanning electron microscope. Adhesion energy of the typical graphene-silicon interface is measured to be 151±28 mJ/m2. The proposed method and our measurements provide insights in fabrication and reliability of microelectromechanical/nanoelectromechanical systems.
Direct Measurement Of Graphene Adhesion On Silicon Surface By Intercalation Of Nanoparticles, Zong Zong, Chia-Ling Chen, Mehmet Dokmeci, Kai-Tak Wan
Direct Measurement Of Graphene Adhesion On Silicon Surface By Intercalation Of Nanoparticles, Zong Zong, Chia-Ling Chen, Mehmet Dokmeci, Kai-Tak Wan
Mehmet R. Dokmeci
We report a technique to characterize adhesion of monolayered/multilayered graphene sheets on silicon wafer. Nanoparticles trapped at graphene-silicon interface act as point wedges to support axisymmetric blisters. Local adhesion strength is found by measuring the particle height and blister radius using a scanning electron microscope. Adhesion energy of the typical graphene-silicon interface is measured to be 151±28 mJ/m2. The proposed method and our measurements provide insights in fabrication and reliability of microelectromechanical/nanoelectromechanical systems.
High-Throughput Assembly Of Nanoelements In Nanoporous Alumina Templates, Evin Gultepe, Dattatri K. Nagesha, Latika Menon, Ahmed A. Busnaina, Srinivas Sridhar
High-Throughput Assembly Of Nanoelements In Nanoporous Alumina Templates, Evin Gultepe, Dattatri K. Nagesha, Latika Menon, Ahmed A. Busnaina, Srinivas Sridhar
Dattatri K. Nagesha
The authors demonstrate a nanofabrication method utilizing nanoporous alumina templates which involves directed three dimensional assembly of nanoparticles inside the pores by means of an electrophoretic technique. In their demonstration, they have assembled polystyrene nanobeads with diameter of 50 nm inside nanopore arrays of height of 250 nm and diameter of 80 nm. Such a technique is particularly useful for large-scale, rapid assembly of nanoelements for potential device applications.
High-Throughput Assembly Of Nanoelements In Nanoporous Alumina Templates, Evin Gultepe, Dattatri K. Nagesha, Latika Menon, Ahmed A. Busnaina, Srinivas Sridhar
High-Throughput Assembly Of Nanoelements In Nanoporous Alumina Templates, Evin Gultepe, Dattatri K. Nagesha, Latika Menon, Ahmed A. Busnaina, Srinivas Sridhar
Latika Menon
The authors demonstrate a nanofabrication method utilizing nanoporous alumina templates which involves directed three dimensional assembly of nanoparticles inside the pores by means of an electrophoretic technique. In their demonstration, they have assembled polystyrene nanobeads with diameter of 50 nm inside nanopore arrays of height of 250 nm and diameter of 80 nm. Such a technique is particularly useful for large-scale, rapid assembly of nanoelements for potential device applications.
Three Dimensional Controlled Assembly Of Gold Nanoparticles Using A Micromachined Platform, Nishant Khanduja, Selvapraba Selvarasah, Chia-Ling Chen, Mehmet R. Dokmeci, Xugang Xiong, Prashanth Makaram, Ahmed A. Busnaina
Three Dimensional Controlled Assembly Of Gold Nanoparticles Using A Micromachined Platform, Nishant Khanduja, Selvapraba Selvarasah, Chia-Ling Chen, Mehmet R. Dokmeci, Xugang Xiong, Prashanth Makaram, Ahmed A. Busnaina
Ahmed A. Busnaina
By using optical lithographic procedures, the authors present a micromachined platform for large scale three dimensional (3D) assembly of gold nanoparticles with diameters of ∼ 50 nm. The gold nanoparticles are formed into 3D low resistance bridges (two terminal resistance of ∼ 40 Ω) interconnecting the two microelectrodes using ac dielectrophoresis. The thickness of the parylene interlevel dielectric can be adjusted to vary the height of the 3D platform for meeting different application requirements. This research represents a step towards realizing high density, three dimensional structures and devices for applications such as nanosensors, vertical integration of nanosystems, and characterization of …
Experimental And Numerical Investigation Of Nanoparticle Removal Using Acoustic Streaming And The Effect Of Time, Kaveh Bakhtari, Rasim O. Guldiken, Prashanth Makaram, Ahmed A. Busnaina, Jin-Goo Park
Experimental And Numerical Investigation Of Nanoparticle Removal Using Acoustic Streaming And The Effect Of Time, Kaveh Bakhtari, Rasim O. Guldiken, Prashanth Makaram, Ahmed A. Busnaina, Jin-Goo Park
Ahmed A. Busnaina
Theremoval of nanoparticles is becoming increasingly challenging as the minimumlinewidth continues to decrease in semiconductor manufacturing. In this paper,the removal of nanoparticles from flat substrates using acoustic streamingis investigated. Bare silicon wafers and masks with a 4 nmsilicon cap layer are cleaned. The silicon-cap films are usedin extreme ultraviolet masks to protect Mo–Si reflective multilayers. Theremoval of 63 nm polystyrene latex (PSL) particles from these substratesis conducted using single-wafer megasonic cleaning. The results show higherthan 99% removal of PSL nanoparticles. The results also showthat dilute SC1 provides faster removal of particles, which isalso verified by the analytical analysis. Particle removal …
Directed Assembly Of Gold Nanoparticle Nanowires And Networks For Nanodevices, Xugang Xiong, Ahmed A. Busnaina, Selvapraba Selvarasah, Sivasubramanian Somu, Ming Wei, Joey Mead, Chia-Ling Chen, Juan Aceros, Prashanth Makaram, Mehmet R. Dokmeci
Directed Assembly Of Gold Nanoparticle Nanowires And Networks For Nanodevices, Xugang Xiong, Ahmed A. Busnaina, Selvapraba Selvarasah, Sivasubramanian Somu, Ming Wei, Joey Mead, Chia-Ling Chen, Juan Aceros, Prashanth Makaram, Mehmet R. Dokmeci
Ahmed A. Busnaina
Alternating electric field is used to assemble gold nanoparticle nanowires from liquid suspensions. The effects of electrode geometry and the dielectrophoresis force on the chaining and branching of nanowire formation are investigated. The nanowire assembly processes are modeled using finite element calculations, and the particle trajectories under the combined influence of dielectrophoresis force and viscous drag are simulated. Nanoparticle nanowires with 10 nm resolution are fabricated. The wires can be further oriented along an externally introduced flow. This work provides an approach towards rapid assembly and organization of ultrasmall nanoparticle networks.
High-Throughput Assembly Of Nanoelements In Nanoporous Alumina Templates, Evin Gultepe, Dattatri K. Nagesha, Latika Menon, Ahmed A. Busnaina, Srinivas Sridhar
High-Throughput Assembly Of Nanoelements In Nanoporous Alumina Templates, Evin Gultepe, Dattatri K. Nagesha, Latika Menon, Ahmed A. Busnaina, Srinivas Sridhar
Ahmed A. Busnaina
The authors demonstrate a nanofabrication method utilizing nanoporous alumina templates which involves directed three dimensional assembly of nanoparticles inside the pores by means of an electrophoretic technique. In their demonstration, they have assembled polystyrene nanobeads with diameter of 50 nm inside nanopore arrays of height of 250 nm and diameter of 80 nm. Such a technique is particularly useful for large-scale, rapid assembly of nanoelements for potential device applications.
Directed Assembly Of Gold Nanoparticle Nanowires And Networks For Nanodevices, Xugang Xiong, Ahmed A. Busnaina, Selvapraba Selvarasah, Sivasubramanian Somu, Ming Wei, Joey Mead, Chia-Ling Chen, Juan Aceros, Prashanth Makaram, Mehmet R. Dokmeci
Directed Assembly Of Gold Nanoparticle Nanowires And Networks For Nanodevices, Xugang Xiong, Ahmed A. Busnaina, Selvapraba Selvarasah, Sivasubramanian Somu, Ming Wei, Joey Mead, Chia-Ling Chen, Juan Aceros, Prashanth Makaram, Mehmet R. Dokmeci
Mehmet R. Dokmeci
Alternating electric field is used to assemble gold nanoparticle nanowires from liquid suspensions. The effects of electrode geometry and the dielectrophoresis force on the chaining and branching of nanowire formation are investigated. The nanowire assembly processes are modeled using finite element calculations, and the particle trajectories under the combined influence of dielectrophoresis force and viscous drag are simulated. Nanoparticle nanowires with 10 nm resolution are fabricated. The wires can be further oriented along an externally introduced flow. This work provides an approach towards rapid assembly and organization of ultrasmall nanoparticle networks.
Three Dimensional Controlled Assembly Of Gold Nanoparticles Using A Micromachined Platform, Nishant Khanduja, Selvapraba Selvarasah, Chia-Ling Chen, Mehmet R. Dokmeci, Xugang Xiong, Prashanth Makaram, Ahmed A. Busnaina
Three Dimensional Controlled Assembly Of Gold Nanoparticles Using A Micromachined Platform, Nishant Khanduja, Selvapraba Selvarasah, Chia-Ling Chen, Mehmet R. Dokmeci, Xugang Xiong, Prashanth Makaram, Ahmed A. Busnaina
Mehmet R. Dokmeci
By using optical lithographic procedures, the authors present a micromachined platform for large scale three dimensional (3D) assembly of gold nanoparticles with diameters of ∼ 50 nm. The gold nanoparticles are formed into 3D low resistance bridges (two terminal resistance of ∼ 40 Ω) interconnecting the two microelectrodes using ac dielectrophoresis. The thickness of the parylene interlevel dielectric can be adjusted to vary the height of the 3D platform for meeting different application requirements. This research represents a step towards realizing high density, three dimensional structures and devices for applications such as nanosensors, vertical integration of nanosystems, and characterization of …