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Full-Text Articles in Nanoscience and Nanotechnology
Partitioning Of Defect Sources And Defects Reduction In Euv Mask Blank Multilayer Deposition, Alin O. Antohe
Partitioning Of Defect Sources And Defects Reduction In Euv Mask Blank Multilayer Deposition, Alin O. Antohe
Legacy Theses & Dissertations (2009 - 2024)
Extreme ultraviolet lithography (EUVL) is the next-generation lithography technology and is slated to replace 193-nanometer argon fluoride (ArF) lithography. EUVL uses 13.5-nanometer wavelength light to expose the photoresist. In doing so it enables the technological achievement of 20-nanometer half-pitch circuits which cannot be achieved with conventional 193-nanometer optical lithography.
Secondary Electron Interactions In Exposures Of Euv Photoresists, Steven Grzeskowiak
Secondary Electron Interactions In Exposures Of Euv Photoresists, Steven Grzeskowiak
Legacy Theses & Dissertations (2009 - 2024)
The microelectronic industry’s movement toward smaller feature sizes has necessitated a shift to extreme ultraviolet (EUV) lithography to enable cost-effective patterning of sub 20-nm features. However, this shift from 193-nm lithography (6.4 eV) to EUV (13.5 nm, 92 eV) poses significant obstacles, such that photolithography is now operating in an energy range above the electron binding energies of common atomic species in photoresists. This significant energy increase means the chemical reactions happening within operate in the realm of radiation chemistry instead of photochemistry since the observed reactions are due almost entirely to the action of photoelectrons as they dissipate their …
Mechanistic Investigation Of Antimony Carboxylate Photoresists For Euv Lithography, Michael Murphy
Mechanistic Investigation Of Antimony Carboxylate Photoresists For Euv Lithography, Michael Murphy
Legacy Theses & Dissertations (2009 - 2024)
In 2019, Extreme Ultraviolet (EUV) lithography begins its integration into high volume manufacturing to replace 193-nm lithography at key steps in the fabrication of integrated circuits. To achieve the requirements of the 7- and 5-nm nodes, a new photoresist technology is required to replace traditional chemically-amplified photoresists (CAR). One novel technology incorporates metal atoms with high EUV absorptivity into the photoresist. In this work, we describe the development, evaluation and mechanistic investigation of triorganoantimony(V) dicarboxylate complexes as novel photoresists for EUV lithography.