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Studies And Progresses On Hole Metallization In High-Density Interconnected Printed Circuit Boards, Zhao-Yun Wang, Lei Jin, Jia-Qiang Yang, Wei-Qing Li, Dong-Ping Zhan, Fang-Zu Yang, Shi-Gang Sun

Journal of Electrochemistry

Printed circuit boards (PCBs) are almost the core components of all electronic systems. With the rapid development of sciences and technologies, PCBs are gradually developing in the direction of multi-layer, thin and high-density wiring due to the functionalization, miniaturization, lightweight and high reliability of electronic products, as well as the widespread popularization of the subminiature package such as chip scale package (CSP) and ball grid array (BGA). Therefore, High-density interconnected printed circuit boards (HDI-PCBs) arise. Hole metallization is one of the core technologies in HDI-PCBs and includes two processes composed of conductive treatment and electron electroplating. Electroless copper plating, as …