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Full-Text Articles in Manufacturing
Autonomous Material Refill For Swarm 3d Printing, William C. Jones
Autonomous Material Refill For Swarm 3d Printing, William C. Jones
Mechanical Engineering Undergraduate Honors Theses
3D printing currently offers robust and cheap rapid prototyping solutions. While standard 3D printing remains at the periphery of mass production, the technology serves as a starting point for the development of swarm manufacturing. Since swarm manufacturing is predicated upon autonomy, swarm technology companies such as AMBOTS are seeking to minimize human involvement in the swarm’s functions. At present, the 3D printing swarm consists of the printers, a transporter which can take them between job sites, and the floor tiles which provide power and support the build surfaces. To add to this ecosystem, this project is focused on the design …
Combined Stressors In Reliability Failure Modes In Flip-Chip Electronic Packaging, Mahsa Montazeri
Combined Stressors In Reliability Failure Modes In Flip-Chip Electronic Packaging, Mahsa Montazeri
Graduate Theses and Dissertations
The trend toward miniaturization of electronic devices to fulfill Moore’s law introduces new reliability concerns to the electronic packaging process while worsening existing primary challenges. In solder interconnect specifically, temperature cycling is one of the prominent failure threats. However, with further downscaling of the flip-chip solder connections, electromigration also present a precarious failure mode in these interconnects. On the other hand, understanding the degradation mechanism in solders is crucial for the power electronic products' reliability considering the industrial tendency to replace wirebonds with solder attachment while improving the current carry capacity. This dissertation utilizes FEA simulation and an experimental approach …
Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji
Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji
Graduate Theses and Dissertations
Semiconductor packaging and development is greatly dependent on the magnitude of interconnect and on-chip stress that ultimately limits the reliability of electronic components. Thermomechanical related strains occur because of the coefficient of thermal expansion mismatch from different conjoined materials being assembled to manufacture a device. To curb the effect of thermal expansion mismatch between conjoined parts, studies have been done in integrating compliant structures between dies, solder balls, and substrates. Initial studies have enabled the design and manufacturing of these structures using a photolithography approach which involves a high number of fabrication steps depending on the complexity of the structures …