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Full-Text Articles in Mechanical Engineering
Development Of A Rapid Fatigue Life Testing Method For Reliability Assessment Of Flip-Chip Solder Interconnects, Cody Jackson Marbut
Development Of A Rapid Fatigue Life Testing Method For Reliability Assessment Of Flip-Chip Solder Interconnects, Cody Jackson Marbut
Graduate Theses and Dissertations
The underlying physics of failure are critical in assessing the long term reliability of power packages in their intended field applications, yet traditional reliability determination methods are largely inadequate when considering thermomechanical failures. With current reliability determination methods, long test durations, high costs, and a conglomerate of concurrent reliability degrading threat factors make effective understanding of device reliability difficult and expensive. In this work, an alternative reliability testing apparatus and associated protocol was developed to address these concerns; targeting rapid testing times with minimal cost while preserving fatigue life prediction accuracy. Two test stands were fabricated to evaluate device reliability …
A Nanoindentation Study Of The Fatigue Properties Of Al/A-Si Core-Shell Nanostructures, Jason Steck
A Nanoindentation Study Of The Fatigue Properties Of Al/A-Si Core-Shell Nanostructures, Jason Steck
Mechanical Engineering Undergraduate Honors Theses
Nanostructure-textured surfaces can reduce friction and increase the reliability of micro- and nanoelectromechanical systems (NEMS/MEMS). For MEMS incorporating moving parts, the fatigue properties of nanostructures pose a challenge to their reliability in long-term applications. In this study, the fatigue behavior of hemispherical Al/a-Si core-shell nanostructures (CSNs), bare hemispherical Al nanodots, and a flat Al/a-Si layered thin film have been studied using nanoindentation and nano-scale dynamic mechanical analysis (nano-DMA) techniques. Fatigue testing with nano-DMA shows that the deformation resistance of CSNs persists through 5.0 × 104 loading cycles at estimated contact pressures greater than 15 GPa. When the a-Si shell …