Mechanical Engineering Commons^™

Characterization Of Flexible Hybrid Electronics Using Stretchable Silver Ink And Ultra-Thin Silicon Die, Joshua A. Ledgerwood

Master's Theses

Flexible Hybrid Electronics (FHEs) offer many advantages to the future of wearable technology. By combining the dynamic performance of conductive inks, and the functionality of ultra-thinned, traditional IC technology, new FHE devices allow for development of applications previously excluded by relying on a specific type of electronics technology.

The characterization and reliability analysis of stretchable conductive inks paired with ultra-thin silicon die in theµm range was conducted. A silver based ink designed to be stretchable was screen printed on a TPU substrate and cured using box oven, conveyor convection oven, and photonic curing processes. Reliability tests were conducted including a …

Quality Improvement In Drilling Silicon By Using Micro Laser Assisted Drilling, Barkin Bakir

The Hilltop Review

The micro-laser assisted drilling (µ-LAD) of monocrystalline silicon (100), using a diamond cutting tool coupled with a laser, was tested in order to improve the cutting edge quality of a drilled samples. The laser beam is transmitted through an optically transparent diamond drill bit and focused precisely at the tool-workpiece interface, where the material is under high pressure induced by the diamond tool. The influence of the laser power on the quality and the inner surface finish of the drilled materials is investigated. Different laser powers were used to carry out the experiments. The experimental results indicated that the µ-LAD …