Mechanical Engineering Commons^™

Metal-Assisted Etching Of Silicon Molds For Electroforming, Ralu Divan, Dan Rosenthal '14, Karim Ogando, Leonidas E. Ocola, Daniel Rosenmann, Nicolaie Moldovan

Student Publications & Research

Ordered arrays of high-aspect-ratio micro/nanostructures in semiconductors stirred a huge scientific interest due to their unique one-dimensional physical morphology and the associated electrical, mechanical, chemical, optoelectronic, and thermal properties. Metal-assisted chemical etching enables fabrication of such high aspect ratio Si nanostructures with controlled diameter, shape, length, and packing density, but suffers from structure deformation and shape inconsistency due to uncontrolled migration of noble metal structures during etching. Hereby the authors prove that a Ti adhesion layer helps in stabilizing gold structures, preventing their migration on the wafer surface while not impeding the etching. Based on this finding, the authors demonstrate …

Continuous Electrowetting In Passivating And Non-Passivating Systems, Mehdi Khodayari

USF Tampa Graduate Theses and Dissertations

Electrowetting is an electromechanical response that can be used to change the equilibrium

shape of droplets on a surface through the application of an electric potential. By applying this potential asymmetrically to a droplet, the droplet can be moved. Typical electrowetting devices use an electrode covered by a dielectric to reduce electrochemical interactions. Successful electrowetting requires electrodes and dielectric layers that can resist damage through many cycles of voltage.

Continuous Electrowetting (CEW) is performed on high resistivity silicon wafers. In this process, when an electric potential difference is applied between the substrate ends, the droplet on the substrate moves towards …