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Dr. Guo-Xiang Wang

Hardness

Articles 1 - 2 of 2

Full-Text Articles in Mechanical Engineering

An Investigation Of Nanoparticles Addition On Solidification Kinetics And Microstructure Development Of Tin–Lead Solder, D. Lin, S. Liu, T. Guo, Guo-Xiang Wang, T. Srivatsan, M. Petraroli Apr 2015

An Investigation Of Nanoparticles Addition On Solidification Kinetics And Microstructure Development Of Tin–Lead Solder, D. Lin, S. Liu, T. Guo, Guo-Xiang Wang, T. Srivatsan, M. Petraroli

Dr. Guo-Xiang Wang

High strength solders can be engineered by adding trace amounts of nanopowders into solder paste. An experimental study was conducted for a better understanding of the solidification kinetics and microstructure development of such nano-composite tin–lead solders. The composite solder pastes were prepared by mechanically mixing nanopowders of either copper or TiO2 with tin–lead powders (tens of microns in size). Solidification experiments of the composite solders were performed in an aluminum crucible with temperature variation during cooling and solidification being measured. For the titanium dioxide (TiO2) nanopowders-reinforced composite solders, the test data reveals the occurrence of melt undercooling …


Synthesis And Characterization Of Nano-Composite Lead-Free Solder, D. Lin, C. Kuo, T. Srivatsan, M. Petraroli, Guo-Xiang Wang Apr 2015

Synthesis And Characterization Of Nano-Composite Lead-Free Solder, D. Lin, C. Kuo, T. Srivatsan, M. Petraroli, Guo-Xiang Wang

Dr. Guo-Xiang Wang

A series of experiments conducted on a lead-free eutectic solder (Sn-3.5%Ag) have shown that addition of trace amounts of nanometer-sized particles does have an influence on mechanical properties of materials. In this study, three different types of nanoparticles (copper, nickel and iron) were chosen as the reinforcing candidate. For each particulate reinforcement the reflow process was performed under identical cooling conditions. Addition of trace amounts of nano-particles alters the kinetics governing solidification of the composite solder paste while concurrently exerting an influence on microstructural development, particularly the formation and presence of second phases in the solidified end product. The nano-sized …