Mechanical Engineering Commons^™

Characterization Of Flexible Hybrid Electronics Using Stretchable Silver Ink And Ultra-Thin Silicon Die, Joshua A. Ledgerwood

Master's Theses

Flexible Hybrid Electronics (FHEs) offer many advantages to the future of wearable technology. By combining the dynamic performance of conductive inks, and the functionality of ultra-thinned, traditional IC technology, new FHE devices allow for development of applications previously excluded by relying on a specific type of electronics technology.

The characterization and reliability analysis of stretchable conductive inks paired with ultra-thin silicon die in theµm range was conducted. A silver based ink designed to be stretchable was screen printed on a TPU substrate and cured using box oven, conveyor convection oven, and photonic curing processes. Reliability tests were conducted including a …

Silicon Wafer Temperature Distribution, Daniel Gonzalez, Nathan Jones, Dylan Justice

Mechanical Engineering

Applied Materials is a global company that designs equipment for use in the semiconductor manufacturing industry. The scope of this project covers process chambers used for depositing thin chemical films onto silicon wafers. These processes must take place in particularly specific environments– including extremely low pressures and high temperatures. One challenge engineers face when designing these processes is carefully controlling the thermal behavior of silicon wafers. Typically, behavior is predicted using time consuming and computationally expensive CFD simulations. We have been asked to address this issue with a simpler, faster model which will allow engineers to reduce the total number …