Mechanical Engineering Commons^™

Adhesion Testing Of Printed Inks While Varying The Surface Treatment Of Polymer Substrates, Clayton Neff, Edwin Elston, Amanda Schrand, Nathan B. Crane

Faculty Publications

Additive manufacturing with conductive materials enables new approaches to printed electronics that are unachievable by standard electronics manufacturing processes. In particular, electronics can be embedded directly into structural components in nearly arbitrary 3D space. While these methods incorporate many of the same materials, the new processing methods require standard test methods to compare materials, processing conditions, and determine design limits. This work demonstrates a test method to quantitatively measure the adhesion failure of printed inks deposited on a substrate without changing the ink printing conditions. The proposed method is an adaption of single lap shear testing in which the lap …