Mechanical Engineering Commons^™

A Parametric Investigation Of A Novel, Modular, Gasketless, Microfluidic Interconnect Using Parallel Superhydrophobic Surfaces, Christopher Ramsey Brown

LSU Master's Theses

The gasketless microfluidic interconnect has the potential to offer a standardized approach to interconnects between modular microfluidic components. This strategy uses parallel superhydrophobic surfaces (contact angle ≥ 150ᴼ) to passively seal adjacent, concentric, microfluidic ports separated by an air gap using a liquid bridge created between the chips. The parallel superhydrophobic surfaces do not require the addition of a gasket or other additional components so that the assembly process scales favorably with an increasing number of fluidic interconnects. The gasketless seal does not contribute to geometric constraint between the component chips which allows alignment between chips to scale favorably with …