Mechanical Engineering Commons^™

Multi-Objective Analysis And Optimization Of Integrated Cooling In Micro-Electronics With Hot Spots, Sohail R. Reddy

FIU Electronic Theses and Dissertations

With the demand of computing power from electronic chips on a constant rise, innovative methods are needed for effective and efficient thermal management. Forced convection cooling through an array of micro pin-fins acts not only as a heat sink, but also allows for the electrical interconnection between stacked layers of integrated circuits. This work performs a multi-objective optimization of three shapes of pin-fins to maximize the efficiency of this cooling system. An inverse design approach that allows for the design of cooling configurations without prior knowledge of thermal mapping was proposed and validated. The optimization study showed that pin-fin configurations …