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Master's Theses

Sputtering

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Full-Text Articles in Other Materials Science and Engineering

Deposition, Characterization, And Fabrication Of A Zinc Oxide Piezoelectric Thin Film Microspeaker Using Dc Reactive Sputtering, Adam Olzick Jun 2012

Deposition, Characterization, And Fabrication Of A Zinc Oxide Piezoelectric Thin Film Microspeaker Using Dc Reactive Sputtering, Adam Olzick

Master's Theses

A piezoelectric microspeaker device that could be used in a variety of acoustic applications was designed and fabricated using a thin film ZnO layer that was reactively DC sputtered onto a single crystalline n-type silicon substrate. When tested the microspeaker did not produce sound due to complications in the etching process, the thickness of the diaphragms, and clamping effects. Instead, a characterization approach was taken and the structural, optical, electrical, and piezoelectric properties of the ZnO were investigated. Scanning electron microscopy, x-ray diffraction, and atomic force microscopy were utilized to discover the ZnO’s structural properties. Using the XRD and SEM, …


Design, Fabrication, And Characterization Of A Thin-Film Nickel-Titanium Shape Memory Alloy Diaphragm For Use In Micro-Electro-Mechanical Systems, Brian Joel Alvarez Aug 2011

Design, Fabrication, And Characterization Of A Thin-Film Nickel-Titanium Shape Memory Alloy Diaphragm For Use In Micro-Electro-Mechanical Systems, Brian Joel Alvarez

Master's Theses

Previous work done at Cal Poly has shown that thin-film nickel-titanium (NiTi) can be easily sputtered onto silicon wafers and annealed to create a crystallized shape memory alloy (SMA) film. Initial work on creating devices yielded cantilevers that were highly warped due to thin-film stress created during the sputtering process. The objective of this work was to create a thin-film NiTi SMA device that could be better characterized. A membrane was selected due to the simplicity of fabrication and testing which would also oppose the thin-film stress due to the increase in attachment points to the substrate.

Silicon wafers were …