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Materials Science and Engineering Commons

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Articles 1 - 5 of 5

Full-Text Articles in Materials Science and Engineering

Giant Magnetostriction In Annealed Co1-XFeX Thin-Films, Dwight Hunter, Will Osborn, Ke Wang, Nataliya Kazantseva, Jason R. Hattrick-Simpers, Richard Suchoski, Ryota Takahashi, Marcus L. Young, Apurva Mehta, Leonid A. Bendersky, Same E. Lofland, Manfred Wuttig, Ichiro Takeuchi Nov 2011

Giant Magnetostriction In Annealed Co1-XFeX Thin-Films, Dwight Hunter, Will Osborn, Ke Wang, Nataliya Kazantseva, Jason R. Hattrick-Simpers, Richard Suchoski, Ryota Takahashi, Marcus L. Young, Apurva Mehta, Leonid A. Bendersky, Same E. Lofland, Manfred Wuttig, Ichiro Takeuchi

Faculty Publications

Chemical and structural heterogeneity and the resulting interaction of coexisting phases can lead to extraordinary behaviours in oxides, as observed in piezoelectric materials at morphotropic phase boundaries and relaxor ferroelectrics. However, such phenomena are rare in metallic alloys. Here we show that, by tuning the presence of structural heterogeneity in textured Co1−xFex thin films, effective magnetostriction λeff as large as 260 p.p.m. can be achieved at low-saturation field of ~10 mT. Assuming λ100 is the dominant component, this number translates to an upper limit of magnetostriction ofλ100≈5λeff >1,000 p.p.m. Microstructural analyses …


Ultrafast Electron Diffraction Study Of The Dynamics Of Antimony Thin Films And Nanoparticles, Mahmoud Abdel-Fattah Jul 2011

Ultrafast Electron Diffraction Study Of The Dynamics Of Antimony Thin Films And Nanoparticles, Mahmoud Abdel-Fattah

Electrical & Computer Engineering Theses & Dissertations

The ultrafast fast phenomena that take place following the application of a 120 fs laser pulse on 20 nm antimony thin films and 40 nm nanoparticles were studied using time-resolved electron diffraction. Samples are prepared by thermal evaporation, at small thickness (< 10 nm) antimony nanoparticles form while at larger thicknesses we get continuous thin films.

The samples are annealed and studied by static heating to determine their Debye temperatures, which were considerably less than the standard value. The thermal expansion under static heating also yielded the expansion coefficient of the sample material. Nanoparticle samples gave a very accurate thermal expansion coefficient (11 × 10-6 K-1).

Ultrafast time resolved electron diffraction …


Section Abstracts: Astronomy, Mathematics And Physics With Materials Science Apr 2011

Section Abstracts: Astronomy, Mathematics And Physics With Materials Science

Virginia Journal of Science

Abstracts for the Astronomy, Mathematics, and Physics with Materials Science Section for the 89th Annual Meeting of the Virginia Academy of Science, May 25-27, 2011, University of Richmond, Richmond VA.


Development Of High Band Gap Absorber And Buffer Materials For Thin Film Solar Cell Applications, Daniel Dwyer Jan 2011

Development Of High Band Gap Absorber And Buffer Materials For Thin Film Solar Cell Applications, Daniel Dwyer

Legacy Theses & Dissertations (2009 - 2024)

CuInGaSe2 (CIGS) device efficiencies are the highest of the thin film absorber materials (vs. CdTe, α-Si, CuInSe2). However, the band gap of the highest efficiency CIGS cells deviates from the expected ideal value predicted by models. Widening the band gap to the theoretically ideal value is one way to increase cell efficiencies. Widening the band gap can be accomplished in two ways; by finding a solution to the Ga-related defects which limit the open circuit voltage at high Ga ratios, or by utilizing different elemental combinations to form an alternative high band gap photoactive Cu-chalcopyrite (which includes …


Nucleation, Wetting And Agglomeration Of Copper And Copper-Alloy Thin Films On Metal Liner Surfaces, Stephanie Florence Labarbera Jan 2011

Nucleation, Wetting And Agglomeration Of Copper And Copper-Alloy Thin Films On Metal Liner Surfaces, Stephanie Florence Labarbera

Legacy Theses & Dissertations (2009 - 2024)

One of the key challenges in fabricating narrower and higher aspect ratio interconnects using damascene technology has been achieving an ultra-thin (~2 nm) and continuous Cu seed coverage on trench sidewalls. The thin seed is prone to agglomeration because of poor Cu wetting on the Ta liner. Using in-situ conductance measurements, the effect of lowering the substrate temperature during Cu seed deposition has been studied on tantalum (Ta) and ruthenium (Ru) liner surfaces. On a Ta surface, it was found that lowering the deposition temperature to -65°C increases the nucleation rate of the Cu thin film, and reduces the minimum …