Open Access. Powered by Scholars. Published by Universities.®
Materials Science and Engineering Commons™
Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 3 of 3
Full-Text Articles in Materials Science and Engineering
Copper Intercalation Into Graphite, Kyle Kalbus
Copper Intercalation Into Graphite, Kyle Kalbus
Theses and Dissertations
An electric brush is necessary for an electric motor to function. The purpose of this thesis is to propose a technique to improve electric brush properties in an effort to produce a more proficient electric motor by creating a new brush material with improved properties and performance. There are many applications for electric motors and each application would benefit from overall, increased proficiency. Understanding the role an electric brush plays within an electric motor is crucial to improving functionality. The proposed technique to create a novel graphite-copper material involves a two-step procedure that will intercalate CuCl2 into the graphite structure, …
Grain Boundaries Structures And Wetting In Doped Silicon, Nickel And Copper, Kaveh Meshinchi Asl
Grain Boundaries Structures And Wetting In Doped Silicon, Nickel And Copper, Kaveh Meshinchi Asl
All Dissertations
This thesis reports a series of fundamental investigations of grain boundary wetting, adsorption and structural (phases) transitions in doped Ni, Cu and Si with technological relevance to liquid metal embrittlement, liquid metal corrosion and device applications. First, intrinsically ductile metals are prone to catastrophic failure when exposed to certain liquid metals, but the atomic level mechanism for this effect is not fully understood. A nickel sample infused with bismuth atoms was characterized and a bilayer interfacial phase that is the underlying cause of embrittlement was observed. In a second related study, we showed that addition of minor impurities can significantly …
Plasma Enhanced Atomic Layer Deposition Of Cu Seed Layers At Low Process Temperatures, Jiajun Mao
Plasma Enhanced Atomic Layer Deposition Of Cu Seed Layers At Low Process Temperatures, Jiajun Mao
Legacy Theses & Dissertations (2009 - 2024)
In conventional Cu interconnect fabrication, a sputtered copper seed layer is deposited before the electrochemically deposited (ECD) copper plating step. However, as interconnect dimensions scale down, non-conformal seed layer growth and subsequent voiding of metallized structures is becoming a critical issue. With its established excellent thickness controllability and film conformality, atomic layer deposition (ALD) is becoming an attractive deposition approach for the sub-24nm fabrication regime. However, in order to achieve a smooth and continuous seed layer deposition, a low process temperature (below 100oC) is needed, given the tendency of Cu agglomeration at elevated temperature. In this research, plasma enhanced ALD …