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Selection Of The Process Parameters For The Mass Plating Of Discrete Electronic Components, Ann Hopper

Articles

The miniaturisation of electronic components coupled with requirements for high temperature lead free soldering has forced the improvement of the termination finish of surface mount components to meet the critical demands of the electronic industry. In the present work the processing parameters necessary to plate miniature multilayer varistors (MLV’s) have been explored. The tooling selected was a “Rotary flow-thru’ plater” which achieved high volume plating with