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Full-Text Articles in Mechanics of Materials
Exploring Methods For Recycling Filament Waste In 3d Printing, Max Rios Carballo
Exploring Methods For Recycling Filament Waste In 3d Printing, Max Rios Carballo
Publications and Research
The goal of the current study is to investigate cutting-edge techniques for recycling filament waste from 3D printing procedures. Appropriate waste management techniques are required to reduce this trash's harmful environmental consequences. The goal of the project is to look at new methods for recycling filament waste in order to minimize disposal and encourage reuse. To acquire data from pertinent papers and research, a thorough literature review methodology was used. The findings show that this issue may be resolved utilizing a variety of recycling techniques, including shredding, melting, and re-extrusion. The type of filament waste and the intended goal will …
Bio-Binder—Innovative Asphalt Technology, Amir Tabakovic
Bio-Binder—Innovative Asphalt Technology, Amir Tabakovic
Articles
The global road network spans 16.3 million km [1], of which 5 million km is in the EU. These road networks fulfil major economic and social goals by facilitating the movement of goods and people throughout the EU, and are therefore of the utmost importance to the economic and social life of the EU [2]. National governments invest heavily in their road networks, e.g., in 2014, EUR 53.33 billion was invested in the development and maintenance of the EU road network [3]. Each year, the world produces 1.6 trillion tonnes of asphalt [4], of which 218 million tonnes is produced …
Metal-Assisted Etching Of Silicon Molds For Electroforming, Ralu Divan, Dan Rosenthal '14, Karim Ogando, Leonidas E. Ocola, Daniel Rosenmann, Nicolaie Moldovan
Metal-Assisted Etching Of Silicon Molds For Electroforming, Ralu Divan, Dan Rosenthal '14, Karim Ogando, Leonidas E. Ocola, Daniel Rosenmann, Nicolaie Moldovan
Student Publications & Research
Ordered arrays of high-aspect-ratio micro/nanostructures in semiconductors stirred a huge scientific interest due to their unique one-dimensional physical morphology and the associated electrical, mechanical, chemical, optoelectronic, and thermal properties. Metal-assisted chemical etching enables fabrication of such high aspect ratio Si nanostructures with controlled diameter, shape, length, and packing density, but suffers from structure deformation and shape inconsistency due to uncontrolled migration of noble metal structures during etching. Hereby the authors prove that a Ti adhesion layer helps in stabilizing gold structures, preventing their migration on the wafer surface while not impeding the etching. Based on this finding, the authors demonstrate …