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Influence Of Flow Rate, Nozzle Speed, Pitch And The Number Of Passes On The Thickness Of S1805 Photoresist In Suss Microtec As8 Spray Coater, Rohan Sanghvi, Gyuseok Kim Oct 2019

Influence Of Flow Rate, Nozzle Speed, Pitch And The Number Of Passes On The Thickness Of S1805 Photoresist In Suss Microtec As8 Spray Coater, Rohan Sanghvi, Gyuseok Kim

Tool Data

S1805 positive photoresist has been deposited on single crystalline Si wafers using a Suss MicroTec Alta Spray. The influence of flow rate, nozzle speed, pitch and number of passes on the thickness of the photoresist was studied. Results show that the thickness of S1805 is linearly proportional to the flow rate and number of passes, and inversely proportional to the nozzle speed and pitch.