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Engineering Science and Materials Commons

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Electrical and Computer Engineering

2012

Conductive Ink

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Full-Text Articles in Engineering Science and Materials

A Novel Method For The Curing Of Metal Particle Loaded Conductive Inks And Pastes, David Adrian Roberson Jan 2012

A Novel Method For The Curing Of Metal Particle Loaded Conductive Inks And Pastes, David Adrian Roberson

Open Access Theses & Dissertations

The emerging technology of printed microelectronics involving the use of conductive inks in conjunction with standard printing techniques offers a fast and low waste method for creating microelectronics compared with standard manufacturing processes. A clear path to the creation of flexible electronics is present due to the ease of printing on flexible substrates. Moreover, creation of novel 3D structural electronics is possible via the integration of printing technologies and additive manufacturing (AM) techniques.

A key obstacle to the manufacturing of flexible and structural electronics comes from the temperature restrictions imposed by the substrates, which are typically polymeric. This hindrance has …