Open Access. Powered by Scholars. Published by Universities.®

Engineering Science and Materials Commons

Open Access. Powered by Scholars. Published by Universities.®

Articles 1 - 2 of 2

Full-Text Articles in Engineering Science and Materials

Inkjet Printing Of Nano-Silver Conductive Ink On Pet Substrate, Skyler Jiang Jun 2017

Inkjet Printing Of Nano-Silver Conductive Ink On Pet Substrate, Skyler Jiang

Materials Engineering

Printing of conductive ink traditionally uses copper-based ink and was used on high temperature metal substrates due to the high curing and sintering temperature of copper. In this experiment, however, Metalon JS-B25P nano-silver conductive ink was printed using an Epson Stylus C88+ inkjet printer on polyethylene terephthalate (PET) based Novele printing media made for low temperature applications. With silver’s lower sintering temperature, the nano-silver particles in this ink are desired to be able to sinter at a low enough temperature to be used on the PET substrate. The printed ink traces were cured with a temperature-controlled hotplate at 100℃, 120℃, …


A Novel Method For The Curing Of Metal Particle Loaded Conductive Inks And Pastes, David Adrian Roberson Jan 2012

A Novel Method For The Curing Of Metal Particle Loaded Conductive Inks And Pastes, David Adrian Roberson

Open Access Theses & Dissertations

The emerging technology of printed microelectronics involving the use of conductive inks in conjunction with standard printing techniques offers a fast and low waste method for creating microelectronics compared with standard manufacturing processes. A clear path to the creation of flexible electronics is present due to the ease of printing on flexible substrates. Moreover, creation of novel 3D structural electronics is possible via the integration of printing technologies and additive manufacturing (AM) techniques.

A key obstacle to the manufacturing of flexible and structural electronics comes from the temperature restrictions imposed by the substrates, which are typically polymeric. This hindrance has …