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Signal Processing Commons

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Full-Text Articles in Signal Processing

Design Of Dc-Link Vscf Ac Electrical Power System For The Embraer 190/195 Aircraft, Eduardo Francis Carvalho Freitas, Nihad E. Daidzic Sep 2017

Design Of Dc-Link Vscf Ac Electrical Power System For The Embraer 190/195 Aircraft, Eduardo Francis Carvalho Freitas, Nihad E. Daidzic

Journal of Aviation Technology and Engineering

A proposed novel DC-Link VSCF AC-DC-AC electrical power system converter for Embraer 190/195 transport category airplane is presented. The proposed converter could replace the existing conventional system based on the CSCF IDGs. Several contemporary production airplanes already have VSCF as a major or backup source of electrical power. Problems existed with the older VSCF systems in the past; however, the switched power electronics and digital controllers have matured and can be now, in our opinion, safely integrated and replace existing constant-speed hydraulic transmissions powering CSCF AC generators. IGBT power transistors for medium-level power conversion and relatively fast efficient switching are …


An Exact Analysis For Four-Order Acousto-Optic Bragg Diffraction Which Incorporates Both Incident Light Angle And Sound Frequency Dependencies, Adeyinka Sunday Ademola May 2017

An Exact Analysis For Four-Order Acousto-Optic Bragg Diffraction Which Incorporates Both Incident Light Angle And Sound Frequency Dependencies, Adeyinka Sunday Ademola

Electrical Engineering Theses

This thesis extends the prior work which produced an exact solution to the four-order acousto-optic (AO) Bragg cell with assumed fixed center frequency and with exact Bragg angle incident light. The extension predicts the model that incorporates the dependencies of both the input angle of light and the sound frequency. Specifically, a generalized 4th order linear differential equation (DE), is developed from a simultaneous analysis of four coupled AO system of DEs. Through standard methods, the characteristic roots, which requires solving a quartic equation, is produced. Subsequently, a derived system of homogeneous solutions, which absorbs the roots obtained using …


System-Layout-Dependent Thermally Induced Solder Stress & Reliability Implications, Ange C. Iradukunda May 2017

System-Layout-Dependent Thermally Induced Solder Stress & Reliability Implications, Ange C. Iradukunda

Mechanical Engineering Undergraduate Honors Theses

Electronic flip chip assemblies consist of dissimilar component materials, which exhibit different CTE. Under thermal cyclic operating conditions, this CTE mismatch produces interfacial and interconnect stresses, which are highly dependent on system layout. In this paper, sensitivity analyses are performed using ANSYS FEA to establish how the proximity and arrangement of neighboring devices affect interconnect stress. Flip chip alignment modes ranging from edge-to-edge to corner-to-corner are studied. Results of these FEA studies, demonstrated that closely packing devices together has the effect of making them act as one. This results in a significant increase in the thermomechanical stresses induced on peripheral …