Electronic Devices and Semiconductor Manufacturing Commons^™

Study Of Radiation Effects In Gan-Based Devices, Han Gao

Electrical Engineering Theses and Dissertations

Radiation tolerance of wide-bandgap Gallium Nitride (GaN) high-electron-mobility transistors (HEMT) has been studied, including X-ray-induced TID effects, heavy-ion-induced single event effects, and neutron-induced single event effects. Threshold voltage shift is observed in X-ray irradiation experiments, which recovers over time, indicating no permanent damage formed inside the device. Heavy-ion radiation effects in GaN HEMTs have been studied as a function of bias voltage, ion LET, radiation flux, and total fluence. A statistically significant amount of heavy-ion-induced gate dielectric degradation was observed, which consisted of hard breakdown and soft breakdown. Specific critical injection level experiments were designed and carried out to explore …

Design And Fabrication Of A Low Power 7.2 Terabit Transmitter For Exascale Computing, Scott Mcwilliams, Scott Mcwilliams

Electrical Engineering Theses and Dissertations

Enhanced Coupled Strength (ECS) gratings fabricated into III-V based devices offer high reflected power per unit length and broad band reflectivity as compared to conventional 1st order gratings, desired qualities for short-haul high speed transmitters that can be implemented without the need for chip-level temperature control, contributing to the low power per transmitted bit. For commercial DBR lasers, the grating reflectivity results in an extremely narrow reflectivity spectrum, which is highly desired for most/many applications, but requires a power hungry thermo-electric cooler to maintain a fixed frequency. The proposed LEAM (laser electro-absorption modulator) requires a broad reflectivity spectrum, which, by …

Raman Thermometry Of Graphene Based Thermal Materials, Pengcheng Xu

Electrical Engineering Theses and Dissertations

With the growing demand for high performance computing, we are pushing for higher performance integrated circuits at an ever faster rate. Recent advances in semiconductor production technology sees transistors with a 5 nm process devices being produced for consumer use. This enabled engineers to pack tens of billions of transistors in a package no larger than a fingernail. However, that brings up a problem that we have been long battling against. How can we get rid of the heat produced by these billions of transistors. The current electronic performance is bottle-necked by the ability of the package taking heat away …

Second-Order Enhanced Coupling Strength Grating Out-Couplers For A Monolithic Laser-Electro-Absorption Modulator, Maryam Dezfuli

Electrical Engineering Theses and Dissertations

Conventional grating out-couplers in III-V waveguides typically require lengths of several hundreds of microns to outcouple 50 to 90% of the incident optical power. Enhanced coupling strength (ECS) gratings, which reduce the out-coupler grating length to tens of microns, have a large relative permittivity difference between the materials on either side of the grating boundary along with a high index cover layer. With appropriately chosen permittivity and layer thicknesses, the addition of a cover layer “pulls” the peak of the optical mode towards the grating region, resulting in a significant increase in the grating confinement factor. The resulting ECS out-coupler …

First Order Enhanced Coupling Strength (Ecs) Gratings For Laser-Electro Absorption Modulator (Eam) Transmitters, Freddie Castillo Ii

Electrical Engineering Theses and Dissertations

Conventional first-order DBR gratings in III-V waveguides often require hundreds of microns to achieve near 100% reflected power and provide narrow spectral reflectivity width for a single wavelength, limiting temperature performance of devices. Narrow reflectivity spectral width is desired for spectroscopy and wavelength division multiplexing applications where device temperature is regulated. However, Enhanced Coupling Strength (ECS) gratings provide in-plane reflectors with significantly higher reflected power per unit length, broad spectral reflectivities, and reduced losses at the waveguide-grating interface in III-V waveguides. These properties of ECS gratings allow integration of optical components such as high-speed modulators with short horizontal cavity lasers …

Machine Learning Approach To Stability Analysis Of Semiconductor Memory Element, Ravindra Thanniru, Gautam Kapila, Nibhrat Lohia

SMU Data Science Review

Memory stability analysis traditionally relied heavily on circuit simulation-based approaches that run Monte Carlo (MC) analysis over various manufacturing and use condition parameters. This paper researches application of Machine Learning approaches for memory element failure analysis which could mimic simulation-like accuracy and minimize the need for engineers to rely heavily on simulators for their validations. Both regressor and classifier algorithms are benchmarked for accuracy and recall scores. A high recall score implies fewer escapes of fails to field and is the metric of choice for comparing algorithm. The paper identifies that recall score in excess of 0.97 can be achieved …

Reducing The Production Cost Of Semiconductor Chips Using (Parallel And Concurrent) Testing And Real-Time Monitoring, Qutaiba Khasawneh

Electrical Engineering Theses and Dissertations

Consumer electronics changed the semiconductor industry by developing many new challenges for consumer products. One of the main challenges in the consumer product is that it propelled the volume of production to massive production, e.g. hundreds of millions of cell phones are produced yearly. Combined with the overproduction of consumer products, price pressure is another challenge for consumer products. Many of the new techniques used in the design and fabrication enabled the integration of more devices in the same chips. This reduced the cost of the chips, lowered the power consumption, increased the circuit operation speed, enabled more reliable implementation, …

Investigating The Effect Of Detecting And Mitigating A Ring Oscillator-Based Hardware Trojan, Lakshmi Ramakrishnan

Electrical Engineering Theses and Dissertations

The outsourcing of the manufacturing process of integrated circuits to fabrications plants all over the world has exposed these chips to several security threats, especially at the hardware level. There have been instances of malicious circuitry, such as backdoors, being added to circuits without the knowledge of the chip designers or vendors. Such threats could be immensely powerful and dangerous against confidentiality, among other vulnerabilities.

Defense mechanisms against such attacks have been probed and defense techniques have been developed. But with the passage of time, attack techniques have improved immensely as well. From directly observing the inputs or outputs, adversaries …

A Comparative Analysis Of Integrated Optical Waveguide Isolators With Magneto-Optic Layers, Reyhane Oztekin

Electrical Engineering Theses and Dissertations

The objective of this study is to theoretically devise an on-chip optical isolator which is monolithically integrated with a semiconductor waveguide layer yielding low loss. The optical properties of iron are modeled for the use of optical waveguide isolators by improving the Brendel-Bormann model. Our model for iron shows excellent fit with the optical data up to 30 electronvolts (eV). The semiconductor optical waveguide isolator with magneto-optic layers based on non-reciprocal loss shift is developed in this study. Fe, Co, and Ni metals as well as cerium-substituted yttrium iron garnet (Ce:YIG) have been used as magneto-optic layers. We have shown …

Cell-Aware Fault Analysis And Test Set Optimization In Digital Integrated Circuits, Fanchen Zhang, Jennifer Dworak

Computer Science and Engineering Theses and Dissertations

Structural tests have many advantages over functional patterns. The fault coverage of structural patterns is generally higher and easier to quantify, well-known algorithms are available to generate them, and they are often a much easier choice for debugging and diagnosis. However, depending on the fault models used, traditional structural patterns can still miss many defects, such as the defects that may occur inside the standard cells, and when chips are placed on a board, they may fail in functional mode even if they pass all structural tests. This can happen even if those same structural tests are applied in-system on …