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Electronic Devices and Semiconductor Manufacturing Commons™
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- Keyword
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- Additive manufacturing (1)
- BESS (1)
- Converters (1)
- Double-sided Cooling (1)
- Efficiency (1)
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- Integrated circuit interconnections (1)
- Inverters (1)
- Low-temperature Co-fired Ceramic Substrate (1)
- Nano Silver Die Attach (1)
- Power Electronic Module (1)
- Power device reliability (1)
- Power loss (1)
- Printed circuit board reliability (1)
- Saber (1)
- Semi Conductor packaging (1)
- Semi conductor reliability (1)
- Wire Bondless (1)
Articles 1 - 3 of 3
Full-Text Articles in Electronic Devices and Semiconductor Manufacturing
Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji
Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji
Graduate Theses and Dissertations
Semiconductor packaging and development is greatly dependent on the magnitude of interconnect and on-chip stress that ultimately limits the reliability of electronic components. Thermomechanical related strains occur because of the coefficient of thermal expansion mismatch from different conjoined materials being assembled to manufacture a device. To curb the effect of thermal expansion mismatch between conjoined parts, studies have been done in integrating compliant structures between dies, solder balls, and substrates. Initial studies have enabled the design and manufacturing of these structures using a photolithography approach which involves a high number of fabrication steps depending on the complexity of the structures …
Comparative Study Of Power Semiconductor Devices In A Multilevel Cascaded H-Bridge Inverter, Kenneth Mordi
Comparative Study Of Power Semiconductor Devices In A Multilevel Cascaded H-Bridge Inverter, Kenneth Mordi
Graduate Theses and Dissertations
This thesis compares the performance of a nine-level transformerless cascaded H-bridge (CHB) inverter with integrated battery energy storage system (BESS) using SiC power MOSFETs and Si IGBTs. Two crucial performance drivers for inverter applications are power loss and efficiency. Both of these are investigated in this thesis. Power devices with similar voltage and current ratings are used in the same inverter topology, and the performance of each device is analyzed with respect to switching frequency and operating temperature. The loss measurements and characteristics within the inverter are discussed. The Saber® simulation software was used for the comparisons. The power MOSFET …
High Temperature Ltcc Based Sic Double-Sided Cooling Power Electronic Module, Hao Zhang
High Temperature Ltcc Based Sic Double-Sided Cooling Power Electronic Module, Hao Zhang
Graduate Theses and Dissertations
This objective of this dissertation research is to investigate a module packaging technology for high temperature double-sided cooling power electronic module application. A high-temperature wire-bondless low-temperature co-fired ceramic (LTCC) based double-sided cooling power electronic module was designed, simulated and fabricated. In this module, the conventional copper base plate is removed to reduce the thermal resistance between the device junctions to the heat sink and to improve the reliability of the module by eliminating the large area solder joint between the power substrate and the copper base plate. A low-temperature co-fired ceramic (LTCC) substrate with cavities and vias is used as …