Electronic Devices and Semiconductor Manufacturing Commons^™

Integration Of Thin Film Tpv Cells To Cvd Diamond Heat Spreaders, Emma J. Renteria

Electrical and Computer Engineering ETDs

In this work, techniques to isolate thermophotovoltaic (TPV) devices from the growth substrate and their subsequent integration with Chemical Vapor Deposition (CVD) diamond heat spreaders will be discussed, with the envisioned goal of fabricating thermally managed cells. CVD diamond heat spreaders are a great option for thermal management of TPV cells. The key requirement, however, is the bonding of the TPV cell directly onto the diamond wafer without the presence of thick (>350 μm) growth substrates, which can offer significant thermal resistance.

The first approach is to release GaSb epitaxial layers from GaSb substrates. However, this is challenging due …