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Computer Engineering Commons

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Full-Text Articles in Computer Engineering

Fast Scale Prototyping For Folded Millirobots, Aaron Hoover, Ronald Fearing Jul 2012

Fast Scale Prototyping For Folded Millirobots, Aaron Hoover, Ronald Fearing

Aaron M. Hoover

We present a set of tools and a process, making use of inexpensive and environmentally friendly materials, that enable the rapid realization of fully functional large scale prototypes of folded mobile millirobots. By mimicking the smart composite microstructure (SCM) process at a 2–10X scale using posterboard, and commonly available polymer films, we can realize a prototype design in a matter of minutes compared with days for a complicated SCM design at the small scale. The time savings enable a significantly shorter design cycle by allowing forimmediate discovery of design flaws and introduction of design improvements prior to beginning construction at …


Rapidly Prototyped Orthotweezers For Automated Microassembly, Aaron Hoover, Ronald Fearing Jul 2012

Rapidly Prototyped Orthotweezers For Automated Microassembly, Aaron Hoover, Ronald Fearing

Aaron M. Hoover

We describe the design, fabrication, and testing of an ultra-low cost orthotweezers system for microassembly. By utilizing rapid prototyping technology, compliant mechanisms, and commodity-grade actuators and sensors, we significantly reduce the complexity and cost of the previous Orthotweezers system without sacrificing functionality. With a force resolution of 0.7mN and a worst case mean positioning repeatability of 23 mum, the system is capable of dexterously manipulating rectangular parts with dimensions 200 mum times 200 mum times 100 mum. Such blocks can then be temporarily attached to thin, delicate, or oddly shaped parts to enable handling and ultimately assembly of micromechanical structures. …


Micro-Switches With Sputtered Au, Aupd, Au-On-Aupt, And Auptcu Alloy Electric Contacts, Ronald A. Coutu Jr., P. E. Kladitis, R. Cortez, R. E. Strawser, Robert L. Crane Sep 2004

Micro-Switches With Sputtered Au, Aupd, Au-On-Aupt, And Auptcu Alloy Electric Contacts, Ronald A. Coutu Jr., P. E. Kladitis, R. Cortez, R. E. Strawser, Robert L. Crane

Electrical and Computer Engineering Faculty Research and Publications

This work is the first to report on a new analytic model for predicting micro-contact resistance and the design, fabrication, and testing of microelectromechanical systems (MEMS) metal contact switches with sputtered bi-metallic (i.e. gold (Au)-on-Au-platinum (Pt), (Au-on-Au-(6%)Pt)), binary alloy (i.e. Au-palladium (Pd), (Au-(2%)Pd)), and tertiary alloy (i.e. Au-Pt-copper (Cu), (Au-(5%)Pt-(0.5%)Cu)) electric contacts. The micro-switches with bi-metallic and binary alloy contacts resulted in contact resistance between 1-2 /spl Omega/ and, when compared to micro-switches with sputtered Au electric contacts, exhibited a 3.3 and 2.6 times increase in switching lifetime, respectively. The tertiary alloy exhibited a 6.5 times increase in switch lifetime …