Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 5 of 5
Full-Text Articles in Chemical Engineering
Expression Of Human Protein C In Mammary Tissue Of Transgenic Mammals , William H. Velander
Expression Of Human Protein C In Mammary Tissue Of Transgenic Mammals , William H. Velander
Department of Chemical and Biomolecular Engineering: Patents
Recombinant protein C characterized by a high percentage of active protein can be obtained in the milk of transgenic mammals that incorporate DNAs according to the present invention. Transgenic mammals of the present invention are produced by introducing into developing embryos DNA that encodes protein C, such that the DNA is stably incorporated in the DNA of germ line cells of the mature mammals and inherited in normal, mendelian fashion.
Fabrication Of Double Side Fully Metallized Plated Thru-Holes, In Polymer Structures, Without Seeding Or Photoprocess, Ravi F. Saraf
Fabrication Of Double Side Fully Metallized Plated Thru-Holes, In Polymer Structures, Without Seeding Or Photoprocess, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.
Sulfur Tolerant Bimetallic Zeolitic Reforming Catalysts, Gustavo F. Larsen
Sulfur Tolerant Bimetallic Zeolitic Reforming Catalysts, Gustavo F. Larsen
Department of Chemical and Biomolecular Engineering: Patents
New compositions of matter comprise a metal from the group consisting of platinum, rhodium and palladium, a metal from the first row of Group VIII of the Periodic Table and a nonacidic L-zeolite. A preferred composition is Pt--Ni/KL-zeolite. Such catalysts are prepared by coimpregnation of the zeolite with the metals. Methods of using the catalysts in reforming, aromatization or dehydrogenation are provided.
Polyelectrolyte Dna Conjugation And Genetic Transformation Of An Animal , William H. Velander
Polyelectrolyte Dna Conjugation And Genetic Transformation Of An Animal , William H. Velander
Department of Chemical and Biomolecular Engineering: Patents
Improved cellulosic beads for use as supports in bioaffinity chromatography are produced by dissolution of cellulose in a chaotropic cellulose solvent, formation of the dissolved cellulose into droplets, and immersion of the droplets into a non-solvent capable of solvent interchange with the cellulose solvent to form generally spherical porous cellulose beads of narrow particle size distribution. The beads formed are preferably made with cellulose having a degree of polymerization between 100 and 200, and the resulting beads when saturated with water without drying contain between 1% and 7% cellulose by weight and have a particle size of at least about …