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Articles 2101 - 2104 of 2104
Full-Text Articles in Engineering
Comparative Evaluation Of The Blends Of Gas-To-Liquid (Gtl) Fuels And Biodiesels With Diesel At High Idling Conditions: An In-Depth Analysis On Engine Performance And Environment Pollutants
Faculty of Engineering University of Malaya
This study focuses on the physicochemical fuel characteristics and engine performance-emission features of three prospective alternative transportation fuels: Alexandrian laurel biodiesel (ALBD), jatropha biodiesel (JBD) and GTL fuel at high idling conditions. The blends of GTL fuel (G10, G20), JBD (J10, J20) and ALBD (AL10, AL20) with diesel had been investigated in a multi-cylinder diesel engine at different load-speed conditions. Analysis of the fuel properties showed a linear variation of the major fuel properties with an increase of alternative fuel quantity in the blends. Engine performance test results revealed an average decrease of brake specific fuel consumption (BSFC) (ca. 8.65-12.26%) …
Zespół Energii Odnawialnej I Zrównoważonego Rozwoju (Eozr), Wojciech M. Budzianowski
Zespół Energii Odnawialnej I Zrównoważonego Rozwoju (Eozr), Wojciech M. Budzianowski
Wojciech Budzianowski
No abstract provided.
Methods Of Extrusion On Demand For High Solids Loading Ceramic Paste In Freeform Extrusion Fabrication, Wenbin Li, Amir Ghazanfari, Ming C. Leu, Robert G. Landers
Methods Of Extrusion On Demand For High Solids Loading Ceramic Paste In Freeform Extrusion Fabrication, Wenbin Li, Amir Ghazanfari, Ming C. Leu, Robert G. Landers
Amir Armani (Ghazanfari)
Intermixing Reactions In Electrodeposited Cu/Sn And Cu/Ni/Sn Multilayer Interconnects During Room Temperature And High Temperature Aging
Faculty of Engineering University of Malaya
Current push for miniaturization and 3D packaging makes it important to understand reactions in interconnects with ultra small volume. In order to reduce processing time and to have more homogeneous interconnects, solder can be designed in a multilayer form with components layer thickness in the sub-micron or even nanometer range. In this work, reaction kinetics in multilayer interconnects consisting stacks of Cu/Sn/Cu and Cu/Ni/Sn/Ni/Sn deposited by electrodeposition were investigated at room temperature and 150 A degrees C. The progress of the reaction in the multilayers was monitored by using XRD, SEM and EDX. Results show that by inserting a 70 …