Open Access. Powered by Scholars. Published by Universities.®

Engineering Commons

Open Access. Powered by Scholars. Published by Universities.®

Articles 61 - 65 of 65

Full-Text Articles in Engineering

Lignocellulosic And Cellulosic Beads For Affinity And Immunoaffinity Chromatography Of High Molecular Weight Protiens, William H. Velander Jul 1994

Lignocellulosic And Cellulosic Beads For Affinity And Immunoaffinity Chromatography Of High Molecular Weight Protiens, William H. Velander

Department of Chemical and Biomolecular Engineering: Patents

Improved cellulosic beads for use as supports in bioaffinity chromatography are produced by dissolution of cellulose in a chaotropic cellulose solvent, formation of the dissolved cellulose into droplets, and immersion of the droplets into a non-solvent capable of solvent interchange with the cellulose solvent to form generally spherical porous cellulose beads of narrow particle size distribution. The beads formed are preferably made with cellulose having a degree of polymerization between 100 and 200, and the resulting beads when saturated with water without drying contain between 1% and 7% cellulose by weight and have a particle size of at least about …


Unzippable Polymer Mask For Screening Operations, Ravi F. Saraf May 1994

Unzippable Polymer Mask For Screening Operations, Ravi F. Saraf

Department of Chemical and Biomolecular Engineering: Patents

The present invention relates to a dry process for forming patterns on a substrate. More particularly, the process contemplates coating an unzippable polymer film with a small amount of desirable UV if required on a substrate; laser ablating said film into a desired pattern or mask; screening a conductive or resistive paste onto the substrate through the ablated features of said mask; heating said substrate and mask to the unzipping temperature of said mask; and, vaporizing said mask and UV absorbing dye if present leaving behind the solid of said conductive or resistive past adhered to the substrate in the …


Electroless Metal Adhesion To Organic Dielectric Material With Phase Separated Morphology, Ravi F. Saraf May 1994

Electroless Metal Adhesion To Organic Dielectric Material With Phase Separated Morphology, Ravi F. Saraf

Department of Chemical and Biomolecular Engineering: Patents

Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a …


Morphological Composite Materials Formed From Different Precursors, Ravi F. Saraf Feb 1994

Morphological Composite Materials Formed From Different Precursors, Ravi F. Saraf

Department of Chemical and Biomolecular Engineering: Patents

A method of producing a multiphase polymer is disclosed whereby the phases have the same chemical structure but have different morphological states and thus different properties. This is achieved by forming a mixture of precursors of the polymer, at least one of the precursors having a reaction rate higher than the other precursor or precursors in the mixture. The precursor having the highest reaction rate is then converted to obtain a composite of a polymer and the precursors that are not polymerized. This mixture might also be formed by mixing a soluble polymer with its precursor. The polymer/precursor composite is …


Solder/Polymer Composite Paste And Method, Ravi F. Saraf Nov 1991

Solder/Polymer Composite Paste And Method, Ravi F. Saraf

Department of Chemical and Biomolecular Engineering: Patents

An improved solder/polymer fluxless composite paste interconnection material having a low reflow temperature to form electrical contacts having good bonding strength and low contact resistance. The present pastes comprise a major proportion of a meltable metal alloy powder filler, free of noble metals and preferably free of lead, a minor proportion of a solution of a temperature-stable thermoplastic polymer having a softening temperature above the melting temperature of the metal powder filler in a volatile solvent which evaporates during reflow, and a minor proportion of a fluxing agent having a boiling point lower than the reflow temperature of the composition …