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Full-Text Articles in Engineering Physics

Computational Modeling Of Black Phosphorus Terahertz Photoconductive Antennas Using Comsol Multiphysics With Experimental Comparison Against A Commercial Lt-Gaas Emitter, Jose Isaac Santos Batista Jul 2021

Computational Modeling Of Black Phosphorus Terahertz Photoconductive Antennas Using Comsol Multiphysics With Experimental Comparison Against A Commercial Lt-Gaas Emitter, Jose Isaac Santos Batista

Graduate Theses and Dissertations

This thesis presents computational models of terahertz (THz) photoconductive antenna (PCA) emitter using COMSOL Multiphysics commercial package. A comparison of the computer simulated radiated THz signal against that of an experimentally measured signal of commercial reference LT-GaAs emitter is presented. The two-dimensional model (2D) aimed at calculating the photoconductivity of a black phosphorus (BP) PCA at two laser wavelengths of 780 nm and 1560 nm. The 2D model was applied to the BP PCA emitter and the LT-GaAs devices to compare their simulated performance in terms of the photocurrent and radiated THz signal pulse. The results showed better performance of …


Multi-Physics Modeling Of Terahertz And Millimeter-Wave Devices, Mohammad Ali Khorrami May 2014

Multi-Physics Modeling Of Terahertz And Millimeter-Wave Devices, Mohammad Ali Khorrami

Graduate Theses and Dissertations

In recent years, there have been substantial efforts to design and fabricate millimeter-wave and terahertz (THz) active and passive devices. Operation of microwave and photonic devices in THz range is limited due to limited maximum allowable electron velocity at semiconductor materials, and large dimensions of optical structures that prohibit their integration into nano-size packages, respectively. In order to address these issues, the application of surface plasmons (SPs) is mostly suggested to advance plasmonic devices and make this area comparable to photonics or electronics.

In this research, the feasibility of implementing THz and millimeter-wave plasmonic devices inside different material platforms including: …