Manufacturing Commons^™

Mechanical And Temperature Resilience Of Multi-Material Systems For Printed Electronics Packaging, Clayton Neff, Justin Nussbaum, Chris Gardiner, Nathan B. Crane, James L. Zunino, Mike Newton

Faculty Publications

In this work, two AM technologies were utilized to compare the effectiveness of fabricating a simple electronic device with a conductive trace and hollow cylinder representative of ‘printed packaging’ that would survive harsh environmental conditions. The printed packaging cylinder delineates printed potting for electronics packaging. An nScrypt direct write (DW) system was the primary manufacturing system but a developing technology—coined large area projection sintering (LAPS)—manufactured a subset of samples for comparison. The tests follow Military Standard (MIL STD) 883K and include resiliency evaluation for die shear strength, temperature cycling, thermal shock, and high G loading by mechanical shock. Results indicate …