Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 1 of 1
Full-Text Articles in Manufacturing
Benchmark Testing Of Gold Ribbon Bonds On Thin-Film Microchips With New Gold Ribbon Auto-Bonder, Austin Conrad
Benchmark Testing Of Gold Ribbon Bonds On Thin-Film Microchips With New Gold Ribbon Auto-Bonder, Austin Conrad
Master's Theses
The focus of this document is on the gold ribbon bond testing and creation of a bonding map for the new gold ribbon Auto-Bonder at Keysight Technologies in Santa Rosa, California. The new Auto-Bonder replaces a nearly 50-year-old machine that no longer had any documentation for the original process of thin-film microchip ribbon bonding. The original process was developed in the early 1970s to provide an electrical connection from the top to the bottom of the microchip. The electrical connection takes the place of what would be a via in a modern silicon microchip. Gold wire bonding is a common …