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- 3D printing (2)
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- Additive manufacturing (1)
- Bio-Inspired Engineering (1)
- Electronic Packaging (1)
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- Snake skin (1)
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Articles 1 - 7 of 7
Full-Text Articles in Manufacturing
Thermal Resistance Characterization Of High-Voltage Sic Power Module, Landon Lemmons
Thermal Resistance Characterization Of High-Voltage Sic Power Module, Landon Lemmons
Mechanical Engineering Undergraduate Honors Theses
Researchers within the University of Arkansas Electrical Engineering Research Department have embarked on a project aimed at enhancing the thermal performance of high-voltage power modules. To aid in the progress of this project, the design, and development of a thermal tester device are needed. The primary objective of this device is to determine the various thermal properties of high-voltage power modules that the electrical engineering department has developed. Additionally, the project aims to facilitate electrical loading tests on power modules and provide researchers with the means to calibrate the power module in terms of thermal load. This project also possesses …
Autonomous Material Refill For Swarm 3d Printing, William C. Jones
Autonomous Material Refill For Swarm 3d Printing, William C. Jones
Mechanical Engineering Undergraduate Honors Theses
3D printing currently offers robust and cheap rapid prototyping solutions. While standard 3D printing remains at the periphery of mass production, the technology serves as a starting point for the development of swarm manufacturing. Since swarm manufacturing is predicated upon autonomy, swarm technology companies such as AMBOTS are seeking to minimize human involvement in the swarm’s functions. At present, the 3D printing swarm consists of the printers, a transporter which can take them between job sites, and the floor tiles which provide power and support the build surfaces. To add to this ecosystem, this project is focused on the design …
Combined Stressors In Reliability Failure Modes In Flip-Chip Electronic Packaging, Mahsa Montazeri
Combined Stressors In Reliability Failure Modes In Flip-Chip Electronic Packaging, Mahsa Montazeri
Graduate Theses and Dissertations
The trend toward miniaturization of electronic devices to fulfill Moore’s law introduces new reliability concerns to the electronic packaging process while worsening existing primary challenges. In solder interconnect specifically, temperature cycling is one of the prominent failure threats. However, with further downscaling of the flip-chip solder connections, electromigration also present a precarious failure mode in these interconnects. On the other hand, understanding the degradation mechanism in solders is crucial for the power electronic products' reliability considering the industrial tendency to replace wirebonds with solder attachment while improving the current carry capacity. This dissertation utilizes FEA simulation and an experimental approach …
Exploring Convergence Of Snake Skin-Inspired Texture Designs And Additive Manufacturing For Mechanical Traction, Catherine Sue Tiner
Exploring Convergence Of Snake Skin-Inspired Texture Designs And Additive Manufacturing For Mechanical Traction, Catherine Sue Tiner
Graduate Theses and Dissertations
This research focuses on the understanding, development, and additive manufacture of a 3D printed snake skin-inspired texture pattern. The design functionalities of snake skin were determined through the study of the snake species Python Regius otherwise known as the ball python. Each scale of a snake has hierarchical texture with hexagonal macro-patterns aligned on the ventral surface of the skin with overriding anisotropic micro textured patterns such as denticulations and fibrils. Using a laser-powder bed fusion (L-PBF) process, 420 stainless steel samples were 3D printed which closely resemble the above described directional texture of natural snake skin. This printed surface …
Design Of A Scara Based Mobile 3d Printing Platform, Zachary Hyden
Design Of A Scara Based Mobile 3d Printing Platform, Zachary Hyden
Mechanical Engineering Undergraduate Honors Theses
Currently 3D printers rely heavily on people to run them, there is no automatic way to start a new print after one has finished. On top of this 3D printers are limited in the area they can print on. Even though the additive manufacturing market is rapidly growing and is increasingly being used in product manufacturing there has yet to be a solution to this problem. This research proposes using mobile 3D printing robots to solve both of these issues. The proposed prototype utilizes a Selective Compliance Assembly Robot Arm (SCARA) based robot capable of cooperatively manufacturing parts. This allows …
Development Of A Rapid Fatigue Life Testing Method For Reliability Assessment Of Flip-Chip Solder Interconnects, Cody Jackson Marbut
Development Of A Rapid Fatigue Life Testing Method For Reliability Assessment Of Flip-Chip Solder Interconnects, Cody Jackson Marbut
Graduate Theses and Dissertations
The underlying physics of failure are critical in assessing the long term reliability of power packages in their intended field applications, yet traditional reliability determination methods are largely inadequate when considering thermomechanical failures. With current reliability determination methods, long test durations, high costs, and a conglomerate of concurrent reliability degrading threat factors make effective understanding of device reliability difficult and expensive. In this work, an alternative reliability testing apparatus and associated protocol was developed to address these concerns; targeting rapid testing times with minimal cost while preserving fatigue life prediction accuracy. Two test stands were fabricated to evaluate device reliability …
Low-Cost Inkjet Process For 3-D Printing, Christopher T. Schmitt
Low-Cost Inkjet Process For 3-D Printing, Christopher T. Schmitt
Mechanical Engineering Undergraduate Honors Theses
This paper presents a low-cost 3-D inkjet process design. Current commercially available 3-D inkjet printers (e.g., Objet Connex) that are capable of multi-material printing are expensive and out-of-reach of most consumers. While fused deposition modeling and other extrusion-based hybrid processes for multi-material printing are becoming available, these techniques are slow and relatively low-resolution. This research attempts to fill the gap by presenting a simple and low-cost solution to bring desktop 3-D inkjet to the community by utilizing components from an Epson inkjet printer. The mechanical system was designed with maximum utilization of the Epson carriage system with the addition of …