Open Access. Powered by Scholars. Published by Universities.®
- Keyword
-
- Reliability (2)
- 3D printed optics (1)
- Additive Manufacturing (1)
- Applied sciences (1)
- Atomic layer deposition (1)
-
- Automotive Electronics (1)
- Compact specimen (1)
- Crack growth (1)
- Creep-fatigue (1)
- Double edge notch (1)
- Electrical energy storage (EES) (1)
- Electrode performance (1)
- Electronic industry (1)
- Finite element (1)
- Flexible Electronics (1)
- Lithium-ion batteries (1)
- Low cycle fatigue (1)
- Micro 3D printing (1)
- Microeheaters (1)
- Microextrusion (1)
- Mission Profile (1)
- Molybednum disilicide (1)
- Novel Processes (1)
- P91 (1)
- Power Electronics (1)
- Sodium-ion batteries (1)
- Solid-state lithium batteries (1)
- Waveguides (1)
Articles 1 - 6 of 6
Full-Text Articles in Applied Mechanics
Combined Stressors In Reliability Failure Modes In Flip-Chip Electronic Packaging, Mahsa Montazeri
Combined Stressors In Reliability Failure Modes In Flip-Chip Electronic Packaging, Mahsa Montazeri
Graduate Theses and Dissertations
The trend toward miniaturization of electronic devices to fulfill Moore’s law introduces new reliability concerns to the electronic packaging process while worsening existing primary challenges. In solder interconnect specifically, temperature cycling is one of the prominent failure threats. However, with further downscaling of the flip-chip solder connections, electromigration also present a precarious failure mode in these interconnects. On the other hand, understanding the degradation mechanism in solders is crucial for the power electronic products' reliability considering the industrial tendency to replace wirebonds with solder attachment while improving the current carry capacity. This dissertation utilizes FEA simulation and an experimental approach …
Mission Profile Effects On Automotive Drivetrain Electronics Reliability: Modeling And Mitigation, Bakhtiyar Mohammad Nafis
Mission Profile Effects On Automotive Drivetrain Electronics Reliability: Modeling And Mitigation, Bakhtiyar Mohammad Nafis
Graduate Theses and Dissertations
The reliability of electronic devices is dependent upon the conditions to which they are subject. Temperature variations coupled with differences in thermal expansion between bonded materials results in thermomechanical stresses to build up, which can instigate failure in the interconnects or other critical regions. With the move towards electrification in the automotive industry, there is the increasingly important consideration of powertrain electronics reliability, the pertinent conditions being governed by the drive cycle or mission profile of the vehicle. The mission profile determines the power dissipated by the electronic devices, which determines the peak and mean temperature, temperature swing and the …
Development Of Novel Battery Materials For Lithium-Ion Batteries And Beyond, Jiyu Cai
Development Of Novel Battery Materials For Lithium-Ion Batteries And Beyond, Jiyu Cai
Graduate Theses and Dissertations
As fossil fuels are depleting and causing environmental issues, it becomes imperative to widely implement renewable energies (e.g., solar and wind power). In this context, electrical energy storage (EES) systems are essential to accommodate the intermittent supply and uneven distribution of renewable energies. To this end, high-energy-density EES devices are highly demanded, such as rechargeable batteries. This dissertation presents my efforts in developing novel battery materials for lithium-ion batteries (LIBs), sodium-ion batteries (SIBs), and solidstate lithium batteries (SSLBs). These efforts include electrochemical evaluations of battery materials, surface modifications of electrodes via atomic layer deposition (ALD), and advanced characterizations of batteries …
Microextrusion 3d Printing Of Optical Waveguides And Microheaters, Edidiong Nseowo Udofia
Microextrusion 3d Printing Of Optical Waveguides And Microheaters, Edidiong Nseowo Udofia
Graduate Theses and Dissertations
The drive for smaller and more compact devices presents several challenges in materials and fabrication strategies. Although photolithography is a well-developed method for creating microdevices, the disparate requirements in fabrication strategies, material choices, equipment and process complexities have limited its applications. Microextrusion printing (μEP) provides a promising alternative for microfabrication. Compared to the traditional techniques, the attractions lie in the wide range of printable material choice, greater design freedom, fewer processing steps, lower cost for customized production, and the plurality of compatible substrates. However, while extrusion-based 3D printing processes have been successfully applied at the macroscale, this seeming simplicity belies …
Microheater Array Powder Sintering (Maps) For Printing Flexible Electronics, Nicholas Holt
Microheater Array Powder Sintering (Maps) For Printing Flexible Electronics, Nicholas Holt
Graduate Theses and Dissertations
Microheater array powder sintering (MAPS) is a novel additive manufacturing process that uses an array of microheaters to selectively sinter powder particles. MAPS shows great promise as a new method of printing flexible electronics by enabling digital curing of conductive inks on a variety of substrates. MAPS operation relies on establishing a precision air gap of a few microns between an array of microheaters, which can reach temperatures of 600°C, and a layer of conductive ink which can be deposited onto a flexible substrate. This system presents challenges, being: the fabrication of a microheater that can reach suitable temperatures in …
Crack Growth Behavior Under Creep-Fatigue Conditions Using Compact And Double Edge Notch Tension-Compression Specimens, Santosh B. Narasimha Chary
Crack Growth Behavior Under Creep-Fatigue Conditions Using Compact And Double Edge Notch Tension-Compression Specimens, Santosh B. Narasimha Chary
Graduate Theses and Dissertations
The American Society for Testing and Materials (ASTM) has recently developed a new standard for creep-fatigue crack growth testing, E 2760-10, that supports testing compact specimens, C(T), under load controlled conditions. C(T) specimens are commonly used for fatigue and creep-fatigue crack growth testing under constant-load-amplitude conditions. The use of these specimens is limited to positive load ratios. They are also limited in the amount of crack growth data that can be developed at high stress intensity values due to accumulation of plastic and/or creep strains leading to ratcheting in the specimen. Testing under displacement control can potentially address these shortcomings …