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Full-Text Articles in Applied Mechanics
Mission Profile Effects On Automotive Drivetrain Electronics Reliability: Modeling And Mitigation, Bakhtiyar Mohammad Nafis
Mission Profile Effects On Automotive Drivetrain Electronics Reliability: Modeling And Mitigation, Bakhtiyar Mohammad Nafis
Graduate Theses and Dissertations
The reliability of electronic devices is dependent upon the conditions to which they are subject. Temperature variations coupled with differences in thermal expansion between bonded materials results in thermomechanical stresses to build up, which can instigate failure in the interconnects or other critical regions. With the move towards electrification in the automotive industry, there is the increasingly important consideration of powertrain electronics reliability, the pertinent conditions being governed by the drive cycle or mission profile of the vehicle. The mission profile determines the power dissipated by the electronic devices, which determines the peak and mean temperature, temperature swing and the …
Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji
Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji
Graduate Theses and Dissertations
Semiconductor packaging and development is greatly dependent on the magnitude of interconnect and on-chip stress that ultimately limits the reliability of electronic components. Thermomechanical related strains occur because of the coefficient of thermal expansion mismatch from different conjoined materials being assembled to manufacture a device. To curb the effect of thermal expansion mismatch between conjoined parts, studies have been done in integrating compliant structures between dies, solder balls, and substrates. Initial studies have enabled the design and manufacturing of these structures using a photolithography approach which involves a high number of fabrication steps depending on the complexity of the structures …
Electroencephalography(Eeg) Data Collection And Processing Through Machine Learning, Jayshree Desai
Electroencephalography(Eeg) Data Collection And Processing Through Machine Learning, Jayshree Desai
Graduate Theses and Dissertations
Machine learning methods are an excellent way for understanding the neural basis of human decision making. Some machine learning systems try to eradicate the need for human intuition in data analysis whereas others embrace a collective approach between humans and machines. The objective of this project is to collect Electroencephalography (EEG) signals through wireless sensors, and the process the collected signals through machine learning methods. The EEG data is collected using three EEG electrodes, each being the positive, negative and ground terminals respectively. Since the signal measures in the unit of micro-volts it needs to be amplified using amplifier circuit. …
A Review Of Variable Valve Timing Devices, Paul Shelton
A Review Of Variable Valve Timing Devices, Paul Shelton
Mechanical Engineering Undergraduate Honors Theses
Variable valve timing (VVT) has evolved from simple, manual controlled engine management to automatic, electronic works of engineering. Starting from the need for more power and extending into fuel efficiency and low emissions, VVT has evolved from the constant changing of needs. This paper summarizes various devices used to control the timing of valves from the early 1920s up until 2007.