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Full-Text Articles in Applied Mechanics
Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji
Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji
Graduate Theses and Dissertations
Semiconductor packaging and development is greatly dependent on the magnitude of interconnect and on-chip stress that ultimately limits the reliability of electronic components. Thermomechanical related strains occur because of the coefficient of thermal expansion mismatch from different conjoined materials being assembled to manufacture a device. To curb the effect of thermal expansion mismatch between conjoined parts, studies have been done in integrating compliant structures between dies, solder balls, and substrates. Initial studies have enabled the design and manufacturing of these structures using a photolithography approach which involves a high number of fabrication steps depending on the complexity of the structures …
Structural Health Monitoring Of Composite Parts: A Review, Jacob Pessin
Structural Health Monitoring Of Composite Parts: A Review, Jacob Pessin
Honors Theses
Structural health monitoring has the potential to allow composite structures to be more reliable and safer, then by using more traditional damage assessment techniques. Structural health monitoring (SHM) utilizes individual sensor units that are placed throughout the load bearing sections of a structure and gather data that is used for stress analysis and damage detection. Statistical time based algorithms are used to analyze collected data and determine both damage size and probable location from within the structure. While traditional calculations and life span analysis can be done for structures made of isotropic materials such as steel or other metals, composites …