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Full-Text Articles in Metallurgy
Intermetalic Growth Rate In Transient Liquid Phase Sintering Of Pb-Free Solder Interconnects, Shuqing Zhang, John Blendell
Intermetalic Growth Rate In Transient Liquid Phase Sintering Of Pb-Free Solder Interconnects, Shuqing Zhang, John Blendell
The Summer Undergraduate Research Fellowship (SURF) Symposium
Following the electron devices are widely used in daily life, Pb-free solder alloy, as the replacement of Pb solder joint material, needs extensive researches to observe the properties for using and simulation purpose. Solder are used as the joint to connect two work pieces in printed wiring board of electronics. Most lead-free solders comprise tin (Sn) as the majority component, and nominally pure b-Sn is the majority phase in the microstructure of these solders. The most important thing for solder joint that researchers care about is its life cycle. Due to the incomplete of the mechanical profile of Pb-free solder …