VLSI and Circuits, Embedded and Hardware Systems Commons^™

Design And Characterization Of Standard Cell Library Using Finfets, Phanindra Datta Sadhu

Master's Theses

The processors and digital circuits designed today contain billions of transistors on a small piece of silicon. As devices are becoming smaller, slimmer, faster, and more efficient, the transistors also have to keep up with the demands and needs of the daily user. Unfortunately, the CMOS technology has reached its limit and cannot be used to scale down due to the transistor's breakdown caused by short channel effects. An alternative solution to this is the FinFET transistor technology, where the gate of the transistor is a three dimensional fin that surrounds the transistor and prevents the breakdown caused by scaling …

Architecting Np-Dynamic Skybridge, Jiajun Shi

Masters Theses

With the scaling of technology nodes, modern CMOS integrated circuits face severe fundamental challenges that stem from device scaling limitations, interconnection bottlenecks and increasing manufacturing complexities. These challenges drive researchers to look for revolutionary technologies beyond the end of CMOS roadmap. Towards this end, a new nanoscale 3-D computing fabric for future integrated circuits, Skybridge, has been proposed [1]. In this new fabric, core aspects from device to circuit style, connectivity, thermal management and manufacturing pathway are co-architected in a 3-D fabric-centric manner.

However, the Skybridge fabric uses only n-type transistors in a dynamic circuit style for logic and memory …