VLSI and Circuits, Embedded and Hardware Systems Commons^™

Multivariate Analysis For The Quantification Of Transdermal Volatile Organic Compounds In Humans By Proton Exchange Membrane Fuel Cell System, Ahmed Hasnain Jalal

FIU Electronic Theses and Dissertations

In this research, a proton exchange membrane fuel cell (PEMFC) sensor was investigated for specific detection of volatile organic compounds (VOCs) for point-of-care (POC) diagnosis of the physiological conditions of humans. A PEMFC is an electrochemical transducer that converts chemical energy into electrical energy. A Redox reaction takes place at its electrodes whereas the volatile biomolecules (e.g. ethanol) are oxidized at the anode and ambient oxygen is reduced at the cathode. The compounds which were the focus of this investigation were ethanol (C₂H₅OH) and isoflurane (C₃H₂ClF₅O), but theoretically, the sensor …

Investigating The Effect Of Detecting And Mitigating A Ring Oscillator-Based Hardware Trojan, Lakshmi Ramakrishnan

Electrical Engineering Theses and Dissertations

The outsourcing of the manufacturing process of integrated circuits to fabrications plants all over the world has exposed these chips to several security threats, especially at the hardware level. There have been instances of malicious circuitry, such as backdoors, being added to circuits without the knowledge of the chip designers or vendors. Such threats could be immensely powerful and dangerous against confidentiality, among other vulnerabilities.

Defense mechanisms against such attacks have been probed and defense techniques have been developed. But with the passage of time, attack techniques have improved immensely as well. From directly observing the inputs or outputs, adversaries …

Skybridge-3d-Cmos: A Fine-Grained Vertical 3d-Cmos Technology Paving New Direction For 3d Ic, Jiajun Shi

Doctoral Dissertations

2D CMOS integrated circuit (IC) technology scaling faces severe challenges that result from device scaling limitations, interconnect bottleneck that dominates power and performance, etc. 3D ICs with die-die and layer-layer stacking using Through Silicon Vias (TSVs) and Monolithic Inter-layer Vias (MIVs) have been explored in recent years to generate circuits with considerable interconnect saving for continuing technology scaling. However, these 3D IC technologies still rely on conventional 2D CMOS’s device, circuit and interconnect mindset showing only incremental benefits while adding new challenges reliability issues, robustness of power delivery network design and short-channel effects as technology node scaling. Skybridge-3D-CMOS (S3DC) is …

Analog Signal Processing Solutions And Design Of Memristor-Cmos Analog Co-Processor For Acceleration Of High-Performance Computing Applications, Nihar Athreyas

Doctoral Dissertations

Emerging applications in the field of machine vision, deep learning and scientific simulation require high computational speed and are run on platforms that are size, weight and power constrained. With the transistor scaling coming to an end, existing digital hardware architectures will not be able to meet these ever-increasing demands. Analog computation with its rich set of primitives and inherent parallel architecture can be faster, more efficient and compact for some of these applications. The major contribution of this work is to show that analog processing can be a viable solution to this problem. This is demonstrated in the three …

Parameters Affecting The Resistivity Of Lp-Ebid Deposited Copper Nanowires, Gabriel Smith

Theses and Dissertations--Electrical and Computer Engineering

Electron Beam Induced Deposition (EBID) is a direct write fabrication process with applications in circuit edit and debug, mask repair, and rapid prototyping. However, it suffers from significant drawbacks, most notably low purity. Work over the last several years has demonstrated that deposition from bulk liquid precursors, rather than organometallic gaseous precursors, results in high purity deposits of low resistivity (LPEBID). In this work, it is shown that the deposits resulting from LP-EBID are only highly conductive when deposited at line doses below 25μC/cm. When the dose exceeds this value, the resulting structure is highly porous providing a poor conductive …