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Full-Text Articles in Engineering

Copper Electrodeposition In Full Wafer Thickness Through-Silicon Vias, Rebecca P. Schmitt Dec 2020

Copper Electrodeposition In Full Wafer Thickness Through-Silicon Vias, Rebecca P. Schmitt

Chemical and Biological Engineering ETDs

Through-silicon vias (TSVs) are a key interconnect technology for advanced packaging of microelectronic devices, and full wafer thickness TSVs are required for certain microelectromechanical systems (MEMS) applications. In this work, electrolytes containing copper sulfate, an acid, chloride, and Tetronic 701 suppressor were implemented for Cu filling of high aspect ratio (10:1), full wafer thickness TSVs. For each electrolyte system, rotating disk electrode voltammetry was used to identify a voltage range for bottom-up Cu filling in the TSVs. Die level feature filling was performed using voltage ramping, which moved active deposition through the vias to yield void-free Cu features. During voltage-controlled …


Machine Learning Augmentation Micro-Sensors For Smart Device Applications, Mohammad H. Hasan Nov 2020

Machine Learning Augmentation Micro-Sensors For Smart Device Applications, Mohammad H. Hasan

Department of Mechanical and Materials Engineering: Dissertations, Theses, and Student Research

Novel smart technologies such as wearable devices and unconventional robotics have been enabled by advancements in semiconductor technologies, which have miniaturized the sizes of transistors and sensors. These technologies promise great improvements to public health. However, current computational paradigms are ill-suited for use in novel smart technologies as they fail to meet their strict power and size requirements. In this dissertation, we present two bio-inspired colocalized sensing-and-computing schemes performed at the sensor level: continuous-time recurrent neural networks (CTRNNs) and reservoir computers (RCs). These schemes arise from the nonlinear dynamics of micro-electro-mechanical systems (MEMS), which facilitates computing, and the inherent ability …


Feasibility Study Of A Mems Threshold-Pressure Sensor Based On Parametric Resonance: Experimental And Theoretical Investigations, Mark Pallay, Meysam Daeichin, Shahrzad Towfighian Nov 2020

Feasibility Study Of A Mems Threshold-Pressure Sensor Based On Parametric Resonance: Experimental And Theoretical Investigations, Mark Pallay, Meysam Daeichin, Shahrzad Towfighian

Mechanical Engineering Faculty Scholarship

A tunable threshold pressure sensor based on para- metric resonance of a microbeam subjected to electrostatic levitation is proposed. Parametric excitation can trigger a large amplitude vibration at twice the natural frequency if the mag- nitude of the driving force is large enough to overcome energy loss mechanisms in the system such as squeeze film damping. This causes a temporarily unstable response with a significant gain in oscillation amplitude over time until it is eventually capped by nonlinearities in the force or material or geometric properties. The instability divides the frequency region into two regions: distinct responses bounded by the …


Modeling And Effects Of Non-Homogeneous Infiltration On Material Properties Of Carbon-Infiltrated Carbon Nanotube Forests, Daniel Owens Snow Aug 2020

Modeling And Effects Of Non-Homogeneous Infiltration On Material Properties Of Carbon-Infiltrated Carbon Nanotube Forests, Daniel Owens Snow

Theses and Dissertations

This work investigates the material properties and production parameters of carbon infiltrated carbon nanotube structures (CI-CNT's). The impact of non homogeneous infiltration and the porosity of cross section regions, coupled with changes in designed geometry, in this case beam width, on the density and modulus of elasticity are compared. Three potential geometric models of beam cross section are proposed and evaluated. 3-point bending, SEM images, and numerical optimization are used to assess the validity of each model and the implications they have for future CI-CNT material applications. Carbon capping near exterior beam surfaces is observed and determined to be a …


Fabrication Of Silicon Microneedles For Dermal Interstitial Fluid Extraction In Human Subjects, Caleb A. Berry Aug 2020

Fabrication Of Silicon Microneedles For Dermal Interstitial Fluid Extraction In Human Subjects, Caleb A. Berry

Electronic Theses and Dissertations

The goal of this project is to design and develop a fabrication process for silicon microneedle arrays to extract dermal interstitial fluid (ISF) from human skin. ISF is a cell- free, living tissue medium that is known to contain many of the same, clinical biomarkers of general health, stress response and immune status as in blood. However, a significant barrier to adoption of ISF as a diagnostic matrix is the lack of a rapid, minimally invasive method of access and collection for analysis. Microfabricated chips containing arrays of microneedles that can rapidly and painlessly access and collect dermal ISF for …


Towards A High Bias Voltage Mems Filter Using Electrostatic Levitation, Mark Pallay, Ronald Miles, Shahrzad Towfighian May 2020

Towards A High Bias Voltage Mems Filter Using Electrostatic Levitation, Mark Pallay, Ronald Miles, Shahrzad Towfighian

Mechanical Engineering Faculty Scholarship

Traditional MEMS filters use a comb drive structure that suffers from the pull- in instability, which places a significant limitation on the achievable signal-to- noise ration of the sensor. Because the output signal from a capacitive sensor

is linearly related to the applied voltage, it is desirable to use a capacitive sensor that can withstand large voltages upwards of 100V. However, the pull-in instability causes high voltages to destroy the device and a trade-off between performance and reliability must be made. Electrostatic levitation, which works by pulling electrodes apart instead of together, eliminates the pull-in instability and allows for very …


Microrobots For Wafer Scale Microfactory: Design Fabrication Integration And Control., Ruoshi Zhang May 2020

Microrobots For Wafer Scale Microfactory: Design Fabrication Integration And Control., Ruoshi Zhang

Electronic Theses and Dissertations

Future assembly technologies will involve higher automation levels, in order to satisfy increased micro scale or nano scale precision requirements. Traditionally, assembly using a top-down robotic approach has been well-studied and applied to micro-electronics and MEMS industries, but less so in nanotechnology. With the bloom of nanotechnology ever since the 1990s, newly designed products with new materials, coatings and nanoparticles are gradually entering everyone’s life, while the industry has grown into a billion-dollar volume worldwide. Traditionally, nanotechnology products are assembled using bottom-up methods, such as self-assembly, rather than with top-down robotic assembly. This is due to considerations of volume handling …


Porous Silica Nanotube Thin Films As Thermally Insulating Barrier Coatings, Derric B. Syme, Jason M. Lund, Brian D. Jensen, Robert C. Davis, Richard R. Vanfleet, Brian D. Iverson Mar 2020

Porous Silica Nanotube Thin Films As Thermally Insulating Barrier Coatings, Derric B. Syme, Jason M. Lund, Brian D. Jensen, Robert C. Davis, Richard R. Vanfleet, Brian D. Iverson

Faculty Publications

The fabrication and examination of a porous silica thin film, potentially for use as an insulating thin film, were investigated. A vertically aligned carbon nanotube (CNT) forest, created by chemical vapor deposition (CVD), was used as scaffolding to construct the porous film. Silicon was deposited on the CNT forest using low-pressure CVD (LPCVD) and then oxidized to remove the CNTs and convert the silicon to silica for electrical or thermal passivation (e.g., thermal barrier). Thermal conductivity was determined using a 1D heat-transfer analysis that equated radiative heat loss in a vacuum with conduction through the substrate and thin film stack. …


Experimental Characterization Of The Electrostatic Levitation Force In Mems Transducers, Meysam Daeichin, Ronald Miles, Shahrzad Towfighian Mar 2020

Experimental Characterization Of The Electrostatic Levitation Force In Mems Transducers, Meysam Daeichin, Ronald Miles, Shahrzad Towfighian

Mechanical Engineering Faculty Scholarship

In this study, a two-step experimental procedure is described to determine the electrostatic levitation force in MEMS transducers. In these two steps, the microstructure is excited quasi-statically and dynamically and its response is used to derive the electrostatic force. The experimental results are obtained for a 1 by 1 plate that employs 112 levitation units. The experimentally obtained force is used in a lumped parameter model to find the microstructure response when it is subjected to different dynamical loads. The natural frequency and the damping ratios in the model are identified from the experimental results. The results show this procedure …


Lateral Pull-In Instability Of Electrostatic Mems Transducers Employing Repulsive Force, Meysam Daeichin, Ronald Miles, Shahrzad Towfighian Jan 2020

Lateral Pull-In Instability Of Electrostatic Mems Transducers Employing Repulsive Force, Meysam Daeichin, Ronald Miles, Shahrzad Towfighian

Mechanical Engineering Faculty Scholarship

We report on the lateral pull-in in capacitive MEMS transducers that employ a repulsive electrostatic force. The moving element in this system undergoes motion in two dimensions. A two degree-offreedom mathematical model is developed to investigate the pull-in quantitatively. The nonlinear electrostatic force, which is a vector function of two spatial coordinates, is determined by calculating the potential energy of the system using a boundary element approach. The equilibrium points are found by numerically solving the nonlinear coupled static equations. A stability analysis reveals that depending on the values of the lateral and transverse stiness, the system undergoes dierent bifurcations …


Development Of A Mems Fabrication Process On Soi To Study High Strain In Transition-Metal Dichalcogenides, Edgar Acosta Jan 2020

Development Of A Mems Fabrication Process On Soi To Study High Strain In Transition-Metal Dichalcogenides, Edgar Acosta

Open Access Theses & Dissertations

Over the recent years there has been an increasing demand of better performing electronics. However, as the semiconductor industry keeps on improving and scaling the technology to the nanometer regime, the passive power density has overcome the overall power consumption of transistors. The inability to reduce the power alongside the scaling of transistors has led the scientific community in the search for alternatives or different solutions to overcome this power crisis. The use of two-dimensional Transition-Metal Dichalcogenides (TMDCS) and Micro-Electro-Mechanical System (MEMS) actuators, in conjunction, has been proposed as an alternative solution [1]. Recent studies of TMDCS have shown a …


Parylene Based Flexible Multifunctional Biomedical Probes And Their Applications, Zhiguo Zhao Jan 2020

Parylene Based Flexible Multifunctional Biomedical Probes And Their Applications, Zhiguo Zhao

Wayne State University Dissertations

MEMS (Micro Electro Mechanical System) based flexible devices have been studied for decades, and they are rapidly being incorporated into modern society in various forms such as flexible electronics and wearable devices. Especially in neuroscience, flexible interfaces provide tremendous possibilities and opportunities to produce reliable, scalable and biocompatible instruments for better exploring neurotransmission and neurological disorders. Of all the types of biomedical instruments such as electroencephalography (EEG) and electrocorticography (ECoG), MEMS-based needle-shape probes have been actively studied in recent years due to their better spatial resolution, selectivity, and sensitivity in chronical invasive physiology monitoring. In order to address the inherent …


Development Of Micro-Scale High Aspect Ratio Patterned Features With Electroless Nickel Plating, Lorli Smith Jan 2020

Development Of Micro-Scale High Aspect Ratio Patterned Features With Electroless Nickel Plating, Lorli Smith

Theses and Dissertations--Mechanical Engineering

This thesis describes a novel method designed to pattern high aspect ratio metallic microscale features using a modified photolithography and electroless nickel plating process. This method utilizes modified photolithography techniques to create a polymer mold that is used to control the location of metal deposition on substrate during electroless nickel plating. In order to generate high aspect ratio mold features, a multiple spin-step process was developed to deposit thick layers of SU-8 photoresist, and inclined lithography was also used to generate tapered sidewalls that could help aid mold removal after plating. Results from electroplating experiments were evaluated using a Zygo …