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Full-Text Articles in Engineering
Improving The High-Frequency Attenuation Of Shunt Capacitor, Low-Pass Filters, Christopher N. Olsen, Thomas Van Doren, Todd H. Hubing, James L. Drewniak, Richard E. Dubroff
Improving The High-Frequency Attenuation Of Shunt Capacitor, Low-Pass Filters, Christopher N. Olsen, Thomas Van Doren, Todd H. Hubing, James L. Drewniak, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Circuit board mounted, shunt capacitive filters are less effective at high frequencies because of the mutual inductance (M) that exists between the input and output ports. An approximate expression for the mutual inductance is M=(μh/2π)ln(h/a); where h=via length and a=radius of the via connecting the capacitor to the return plane. The reduced mutual inductance associated with the new, three-terminal, surface-mounted capacitor results in more than 15 dB increased attenuation compared to two-terminal capacitors over the 0.3-6.0 GHz range with 50 Ω source and load terminations
Mitigating Power Bus Noise With Embedded Capacitance In Pcb Designs, Minjia Xu, Todd H. Hubing, Juan Chen, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Mitigating Power Bus Noise With Embedded Capacitance In Pcb Designs, Minjia Xu, Todd H. Hubing, Juan Chen, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
This paper investigates the power bus noise and power bus impedance of printed circuit boards with four different kinds of embedded capacitance. These boards have power-ground plane pairs separated by a very thin layer of material with high dielectric permittivity. It is shown that embedded capacitance effectively reduces power bus noise over the entire frequency range evaluated (up to 5 GHz).
Dc Power Bus Design With Fdtd Modeling Including A Dispersive Media, Xiaoning Ye, Jun Fan, Marina Koledintseva, James L. Drewniak
Dc Power Bus Design With Fdtd Modeling Including A Dispersive Media, Xiaoning Ye, Jun Fan, Marina Koledintseva, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
DC power-bus modeling in high-speed digital design using the FDTD method is reported here. The dispersive medium is approximated by a Debye model to account for the loss. A wide band frequency response (100 MHz-5 GHz) is obtained through a single FDTD simulation. Favorable agreement is achieved between the modeled and measured results for a typical DC power-bus structure with multiple SMT decoupling capacitors mounted on the board. The FDTD tool is then applied to investigate the effects of local decoupling on a DC power-bus. The modeled results agree with the results from another modeling tool, the CEMPIE (a circuit …
Quantifying Decoupling Capacitor Location, Jun Fan, James L. Knighten, Antonio Orlandi, Norman W. Smith, James L. Drewniak
Quantifying Decoupling Capacitor Location, Jun Fan, James L. Knighten, Antonio Orlandi, Norman W. Smith, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Decoupling capacitor location in DC power bus design is a critical design choice for which proven guidelines are not well established. The mutual inductance between two closely spaced vias can have a great impact on the coupling between an IC and a decoupling capacitor. This coupling is a function of the spacing between the IC and capacitor, and spacing between power and ground layers. The impact of the mutual inductance on decoupling, i.e., local versus global decoupling, was studied, using a circuit extraction approach based on a mixed-potential integral equation. Modeling indicates that local decoupling has benefits over global decoupling …
Experimental Evaluation Of Power Bus Decoupling On A 4-Layer Printed Circuit Board, Juan Chen, Minjia Xu, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Experimental Evaluation Of Power Bus Decoupling On A 4-Layer Printed Circuit Board, Juan Chen, Minjia Xu, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
The switching of active devices on printed circuit boards (PCBs) can cause a momentary surge or drop in the power bus voltage. Decoupling capacitors are often utilized to alleviate this problem. They help to stabilize the power bus voltage by supplying transient current to active devices. The decoupling strategy, including where to place the high-frequency decoupling capacitors, is often a topic of debate. This paper examines the effect of decoupling capacitor placement on a 4-layer printed circuit board. Some design guidelines are provided.
Modeling Emi Resulting From A Signal Via Transition Through Power/Ground Layers, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, James L. Drewniak
Modeling Emi Resulting From A Signal Via Transition Through Power/Ground Layers, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Signal transitioning through layers on vias are very common in multi-layer printed circuit board (PCB) design. For a signal via transitioning through the internal power and ground planes, the return current must switch from one reference plane to another reference plane. The discontinuity of the return current at the via excites the power and ground planes, and results in noise on the power bus that can lead to signal integrity, as well as EMI problems. Numerical methods, such as the finite-difference time-domain (FDTD), Moment of Methods (MoM), and partial element equivalent circuit (PEEC) method, were employed herein to study this …
Rf Isolation Using Power Islands In Dc Power Bus Design, Jun Fan, Yong Ren, Juan Chen, David M. Hockanson, Hao Shi, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Rf Isolation Using Power Islands In Dc Power Bus Design, Jun Fan, Yong Ren, Juan Chen, David M. Hockanson, Hao Shi, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Power island structures are often employed for minimizing the propagation of high-frequency noise on DC power buses. The rationale is based on introducing a series impedance in the power plane to provide isolation of a noise source from the rest of the PCB design. The power island concept is investigated herein experimentally, to determine its noise mitigation attributes and limitations. A modeling approach that is suitable for arbitrary PCB island geometries including lumped SMT decoupling capacitors is also presented. The modeling and measurements indicate that island structures can achieve some degree of isolation under certain conditions.
Analysis Of A Novel Four-Level Dc/Dc Boost Converter, Keith Corzine, Sonal K. Majeethia
Analysis Of A Novel Four-Level Dc/Dc Boost Converter, Keith Corzine, Sonal K. Majeethia
Electrical and Computer Engineering Faculty Research & Creative Works
In this paper, novel two-quadrant buck/boost and one-quadrant boost four-level DC/DC converters are introduced. The primary application for these converters is that of interfacing a low voltage DC source, such as a fuel cell or battery, to a high-voltage four-level inverter. One important feature of the four-level DC/DC converters proposed herein is the ability to perform the power conversion and balance the inverter capacitor voltages simultaneously. With the capacitor voltage balancing, it is possible to obtain the full voltage from the inverter. For the boost converter, the steady-state and nonlinear average-value (NLAM) models are developed. The NLAM is verified against …
Incorporating Vertical Discontinuities In Power-Bus Modeling Using A Mixed-Potential Integral Equation And Circuit Extraction Formulation, Jun Fan, Hao Shi, James L. Drewniak, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Incorporating Vertical Discontinuities In Power-Bus Modeling Using A Mixed-Potential Integral Equation And Circuit Extraction Formulation, Jun Fan, Hao Shi, James L. Drewniak, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
Noise on the DC power-bus attributed to device switching is among the primary sources of EMI and signal integrity problems. A mixed-potential integral equation formulation with circuit extraction approach is used to model the planar multi-layer power-bus geometry, which can also include arbitrary shaped power regions on multiple layers. Incorporating vertical discontinuities, e.g., decoupling capacitor interconnects, is a critical aspect of the modeling, and must be done properly since they are included as a lumped element model and not a part of the MPIE formulation. Agreement with experimental results demonstrate the present approach.
An Experimental Investigation Of 4-Layer Printed Circuit Board Decoupling, Todd H. Hubing, Thomas Van Doren, Fei Sha, James L. Drewniak, Michael J. Wilhelm
An Experimental Investigation Of 4-Layer Printed Circuit Board Decoupling, Todd H. Hubing, Thomas Van Doren, Fei Sha, James L. Drewniak, Michael J. Wilhelm
Electrical and Computer Engineering Faculty Research & Creative Works
This paper examines the measured power bus impedance of fully populated 4-layer printed circuit boards with internal power and ground planes. Three boards provided by two leading computer companies were evaluated. Each of the state-of-the-art high-speed boards used in this study employed surface-mount decoupling capacitors to reduce noise on the power bus. The boards were measured with and without some or all of their decoupling capacitance. The effectiveness of the decoupling capacitors as a function of location and frequency and the relationship between board impedance and power bus noise was explored. The behavior of 4-layer boards is shown to be …
Power Bus Decoupling On Multilayer Printed Circuit Boards, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, David M. Hockanson
Power Bus Decoupling On Multilayer Printed Circuit Boards, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, David M. Hockanson
Electrical and Computer Engineering Faculty Research & Creative Works
Guidelines for the selection and placement of decoupling capacitors that work well for one-sided or two-sided printed circuit boards are not appropriate for multilayer boards with power and ground planes. Boards without internal planes take advantage of the power bus inductance to help decouple components at the higher frequencies. An effective decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus.