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Full-Text Articles in Engineering
Solution Of Nonlinear Transient Heat Transfer Problems, Donovan O. Buckley
Solution Of Nonlinear Transient Heat Transfer Problems, Donovan O. Buckley
FIU Electronic Theses and Dissertations
In the presented thesis work, meshfree method with distance fields was extended to obtain solution of nonlinear transient heat transfer problems. The thesis work involved development and implementation of numerical algorithms, data structure, and software. Numerical and computational properties of the meshfree method with distance fields were investigated. Convergence and accuracy of the methodology was validated by analytical solutions, and solutions produced by commercial FEM software (ANSYS 12.1). The research was focused on nonlinearities caused by temperature-dependent thermal conductivity. The behavior of the developed numerical algorithms was observed for both weak and strong temperature-dependency of thermal conductivity. Oseen and Newton-Kantorovich …
Steady-State Green’S Function Solution For Moving Media With Axial Conduction, A. Haji-Sheikh, J. V. Beck, Kevin D. Cole
Steady-State Green’S Function Solution For Moving Media With Axial Conduction, A. Haji-Sheikh, J. V. Beck, Kevin D. Cole
Department of Mechanical and Materials Engineering: Faculty Publications
The objective of this presentation is the development of a generalized steady-state Green’s function solution to study the temperature field in moving bodies. This type of solution permits the inclusion of different nonhomogeneous boundary conditions, volumetric heat sources, and possible position-dependent thermophysical properties. Although the mathematical formulation is for moving solids, it can be used to study the heat transfer in a moving fluid with a non-uniform velocity distribution passing through a micro-channel or fluid-saturated porous ducts. Additionally, this presentation includes the application of this Green’s function solution to acquire numerical information for selected examples to further illustrate the numerical …
Note: Thermal Analog To Atomic Force Microscopy Force-Displacement Measurements For Nanoscale Interfacial Contact Resistance, Brian D. Iverson, John E. Blendell, Suresh V. Garimella
Note: Thermal Analog To Atomic Force Microscopy Force-Displacement Measurements For Nanoscale Interfacial Contact Resistance, Brian D. Iverson, John E. Blendell, Suresh V. Garimella
Faculty Publications
Thermal diffusion measurements on polymethylmethacrylate-coated Si substrates using heated atomic force microscopy tips were performed to determine the contact resistance between an organic thin film and Si. The measurement methodology presented demonstrates how the thermal contrast signal obtained during a force-displacement ramp is used to quantify the resistance to heat transfer through an internal interface. The results also delineate the interrogation thickness beyond which thermal diffusion in the organic thin film is not affected appreciably by the underlying substrate.
Thermal Analog To Afm Force-Displacement Measurements For Nanoscale Interfacial Contact Resistance, Brian D. Iverson, John E. Blendell, Suresh V. Garimella
Thermal Analog To Afm Force-Displacement Measurements For Nanoscale Interfacial Contact Resistance, Brian D. Iverson, John E. Blendell, Suresh V. Garimella
Faculty Publications
Thermal diffusion measurements on PMMA-coated Si substrates using heated AFM tips were performed to determine the contact resistance between an organic thin film and Si. The measurement methodology presented demonstrates how the thermal contrast signal obtained during a force-displacement ramp is used to quantify the resistance to heat transfer through an internal interface. The results also delineate the interrogation thickness beyond which thermal diffusion in the organic thin film is not affected appreciably by the underlying substrate.