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Full-Text Articles in Engineering
Modeling Issues For Full-Wave Numerical Emi Simulation, Michael A. Cracraft, Xiaoning Ye, Chen Wang, Sandeep K. R. Chandra, James L. Drewniak
Modeling Issues For Full-Wave Numerical Emi Simulation, Michael A. Cracraft, Xiaoning Ye, Chen Wang, Sandeep K. R. Chandra, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
In electromagnetic modeling, agreement between modeling and measurements is a common goal. There are questions that define every model. What is to be modeled? How is it going to be modeled? At what scale is it to be modeled? Through sample results and discussion, this paper addresses some general and some specific elements of model veracity. Through determination, numerical models can certainly be pushed to match any measured results. However, in the end the question that this paper addresses is not necessarily "How good can this model be?" as it is "Is this model good enough?".
Memory Dimm Dc Power Distribution Analysis And Design, Jingkun Mao, Chen Wang, Giuseppe Selli, Bruce Archambeault, James L. Drewniak
Memory Dimm Dc Power Distribution Analysis And Design, Jingkun Mao, Chen Wang, Giuseppe Selli, Bruce Archambeault, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
DC power bus design is critical in meeting signal integrity (SI) and electromagnetic compatibility (EMC) requirements. A suitable modeling tool is beneficial to evaluate power bus design and develop design guidelines. This paper discusses difficulties met in evaluating the power distribution design on a dual inline memory module (DIMM) board, such as a power bus with arbitrary shape, parasitic inductance associated with vias, and so on. Moreover, some solutions are given in this paper. A simple cavity model with a segmentation method was employed to model a power bus with irregular shapes. The partial element equivalent circuit (PEEC) technique was …
Anticipating Emi Using Transfer Functions And Signal Integrity Information, Chen Wang, James L. Drewniak, Jim Nadolny
Anticipating Emi Using Transfer Functions And Signal Integrity Information, Chen Wang, James L. Drewniak, Jim Nadolny
Electrical and Computer Engineering Faculty Research & Creative Works
Discontinuities in a circuit can lead to signal integrity as well as EMI problems. A method, which efficiently combines full-wave tools and circuit simulators, is proposed herein to analyze the coupling at discontinuities. The proposed method may be applied to practical engineering designs.
Lumped-Circuit Model Extraction For Vias In Multilayer Substrates, Jun Fan, James L. Drewniak, James L. Knighten
Lumped-Circuit Model Extraction For Vias In Multilayer Substrates, Jun Fan, James L. Drewniak, James L. Knighten
Electrical and Computer Engineering Faculty Research & Creative Works
Via interconnects in multilayer substrates, such as chip scale packaging, ball grid arrays, multichip modules, and printed circuit boards (PCB) can critically impact system performance. Lumped-circuit models for vias are usually established from their geometries to better understand the physics. This paper presents a procedure to extract these element values from a partial element equivalent circuit type method, denoted by CEMPIE. With a known physics-based circuit prototype, this approach calculates the element values from an extensive circuit net extracted by the CEMPIE method. Via inductances in a PCB power bus, including mutual inductances if multiple vias are present, are extracted …
Application Of The Cavity Model To Lossy Power-Return Plane Structures In Printed Circuit Boards, Minjia Xu, Hao Wang, Todd H. Hubing
Application Of The Cavity Model To Lossy Power-Return Plane Structures In Printed Circuit Boards, Minjia Xu, Hao Wang, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Power-return plane pairs in printed circuit boards are often modeled as resonant cavities. Cavity models can be used to calculate transfer impedance parameters used to predict levels of power bus noise. Techniques for applying the cavity model to lossy printed circuit board geometries rely on a low-loss assumption in their derivations. Boards that have been designed to damp power bus resonances (e.g., boards with embedded capacitance) generally violate this low-loss assumption. This paper investigates the validity of the cavity model when applied to printed circuit board structures where the board resonances are significantly damped. Cavity modeling results for sample lossy …