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Full-Text Articles in Engineering
Efficient Prediction Of Rf Interference In A Shielding Enclosure With Pcbs Using A General Segmentation Method, Yaojiang Zhang, Xiaopeng Dong, Zhenwei Yu, Francesco De Paulis, Gang Feng, Jason A. Mix, Daniel Hua, Kevin P. Slattery, James L. Drewniak, Jun Fan
Efficient Prediction Of Rf Interference In A Shielding Enclosure With Pcbs Using A General Segmentation Method, Yaojiang Zhang, Xiaopeng Dong, Zhenwei Yu, Francesco De Paulis, Gang Feng, Jason A. Mix, Daniel Hua, Kevin P. Slattery, James L. Drewniak, Jun Fan
Electrical and Computer Engineering Faculty Research & Creative Works
Cavity model with segmentation method is extended to the analysis of radio frequency interference (RFI) problems in a shielding enclosure with printed circuit boards (PCBs) . Sixteen different Green's functions, instead of one in the conventional segmentation method developed for PCB cavities, are introduced to describe the fields in various cavities formed by enclosure walls and PCB copper planes. Both horizontal and vertical connections among these cavities are achieved by enforcing the boundary conditions along their common interfaces. Numerical examples demonstrate the efficiency and accuracy of the method by compared with full wave simulations.
Characterization Of Serial Links At 5.5gbps On Fr4 Backplanes, Vittorio Ricchiuti, Antonio Orlandi, James L. Drewniak, Francesco De Paulis
Characterization Of Serial Links At 5.5gbps On Fr4 Backplanes, Vittorio Ricchiuti, Antonio Orlandi, James L. Drewniak, Francesco De Paulis
Electrical and Computer Engineering Faculty Research & Creative Works
Nowdays the fast and increased demand for bandwidth in the telecommunication world translates into the design of complex boards exchanging data at high bit rate in reduced design cycle. Sometimes it is impossible to spent time in setting pre-layout simulations, because they are not compatible with the design time schedule. In this scenario it is better to design the boards using experience and then make simulations in conjunction with measurements, using customized numerical tools which don't need complex models.
Influence Of An Extended Stub At Connector Ports On Signal Launches And Trl De-Embedding, Jianmin Zhang, James L. Drewniak, David Pommerenke, Bruce Archambeault, Zhiping Yang, Wheling Cheng, John Fisher, Sergio Camerlo
Influence Of An Extended Stub At Connector Ports On Signal Launches And Trl De-Embedding, Jianmin Zhang, James L. Drewniak, David Pommerenke, Bruce Archambeault, Zhiping Yang, Wheling Cheng, John Fisher, Sergio Camerlo
Electrical and Computer Engineering Faculty Research & Creative Works
Characterization of PCBs (Printed Circuit Boards) is usually associated with measurement using a VNA (Vector Network Analyzer) in the frequency-domain or a TDR (Time Domain Reflectometer) in the time-domain. The often used signal launch techniques on PCBs based on the VNA or TDR measurement in the microwave frequency range use SMA or 3.5 mm connectors, in edge-launch or vertical-launch fashions. The signal transition between the launch port and the DUT (Device Under Test) introduces errors in the measurement, which is dominant when compared with a transmission line itself on the PCB as the technologies of PCB manufacturing well developed today. …
Characterizing Package/Pcb Pdn Interactions From A Full-Wave Finite-Difference Formulation, Shishuang Sun, David Pommerenke, James L. Drewniak, Kai Xiao, Sin-Ting Chen, Tzong-Lin Wu
Characterizing Package/Pcb Pdn Interactions From A Full-Wave Finite-Difference Formulation, Shishuang Sun, David Pommerenke, James L. Drewniak, Kai Xiao, Sin-Ting Chen, Tzong-Lin Wu
Electrical and Computer Engineering Faculty Research & Creative Works
A novel approach of equivalent circuit model extraction is developed for modeling of integrated package and PCB power distribution networks (PDN). The integrated PDNs are formulated from a full-wave finite-difference algorithm, and the resulting matrix equations are converted to equivalent circuits. The equivalent circuits, as well as the decoupling capacitors and the attached circuit components, can be analyzed with a SPICE-like solver in both the time and frequency domains. The modeling of dielectric loss is also addressed. The method is used to model three PDN problems including a simple power bus, a BGA package mounting on a PCB, and a …
An Efficient Approach For Power Delivery Network Design With Closed-Form Expressions For Parasitic Interconnect Inductances, Chen Wang, Jingkun Mao, Giuseppe Selli, Shaofeng Luan, Lin Zhang, Jun Fan, David Pommerenke, Richard E. Dubroff, James L. Drewniak
An Efficient Approach For Power Delivery Network Design With Closed-Form Expressions For Parasitic Interconnect Inductances, Chen Wang, Jingkun Mao, Giuseppe Selli, Shaofeng Luan, Lin Zhang, Jun Fan, David Pommerenke, Richard E. Dubroff, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Investigation of a dc power delivery network, consisting of a multilayer PCB using area fills for power and return, involves the distributed behavior of the power/ground planes and the parasitics associated with the lumped components mounted on it. Full-wave methods are often employed to study the power integrity problem. While full-wave methods can be accurate, they are time and memory consuming. The cavity model of a rectangular structure has previously been employed to efficiently analyze the simultaneous switching noise (SSN) in the power distribution network. However, a large number of modes in the cavity model are needed to accurately simulate …
Circuit Models For Power Bus Structures On Printed Circuit Boards Using A Hybrid Fem-Spice Method, Todd H. Hubing, Chunlei Guo
Circuit Models For Power Bus Structures On Printed Circuit Boards Using A Hybrid Fem-Spice Method, Todd H. Hubing, Chunlei Guo
Electrical and Computer Engineering Faculty Research & Creative Works
Power bus structures consisting of two parallel conducting planes are widely used on high-speed printed circuit boards. In this paper, a full-wave finite-element method (FEM) method is used to analyze power bus structures, and the resulting matrix equations are converted to equivalent circuits that can be analyzed using SPICE programs. Using this method of combining FEM and SPICE, power bus structures of arbitrary shape can be modeled efficiently both in the time-domain and frequency-domain, along with the circuit components connected to the bus. Dielectric loss and losses due to the finite resistance of the power planes can also be modeled. …
Complex Power Distribution Network Investigation Using Spice Based Extraction From First Principle Formulations, Giuseppe Selli, James L. Drewniak, Richard E. Dubroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean Mccoy, Bruce Archambeault, Stefano Grivet-Talocia, Flavio G. Canavero
Complex Power Distribution Network Investigation Using Spice Based Extraction From First Principle Formulations, Giuseppe Selli, James L. Drewniak, Richard E. Dubroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean Mccoy, Bruce Archambeault, Stefano Grivet-Talocia, Flavio G. Canavero
Electrical and Computer Engineering Faculty Research & Creative Works
The modeling and the analysis of the power distribution networks (PDN) within multi-layer printed circuit board is crucial for the investigation of the performance of PCB systems. Carrying out such analyses in SPICE based tools has the advantage of being faster than the corresponding full-wave modeling and it allows obtaining both frequency and time domain results.
A Hybrid Approach To Decrease Port Influence In Transmission Line Characterization, Jianmin Zhang, David Pommerenke, James L. Drewniak, Richard E. Dubroff, Zhiping Yang, Wheling Cheng, John Fisher, Sergio Camerlo
A Hybrid Approach To Decrease Port Influence In Transmission Line Characterization, Jianmin Zhang, David Pommerenke, James L. Drewniak, Richard E. Dubroff, Zhiping Yang, Wheling Cheng, John Fisher, Sergio Camerlo
Electrical and Computer Engineering Faculty Research & Creative Works
Characterization and models for multi-gigabit signaling is an important issue in modern digital system. A good physical based model relies on a precise characterization of the test board. Typically, the characterization of the test board is associated with scattering matrix parameter measurement, which can be done with a VNA (Vector Network Analyzer) in the frequency-domain or a TDR (Time Domain Reflectometer) in the time-domain. The commonly used launch techniques on PCBs (Printed Circuit Boards) associated with the VNA or TDR measurement in the microwave frequency range use SMA or 3.5 mm connectors, in edge-launch or vertical-launch fashions. The transition between …
Power Integrity Investigation Of Bga Footprints By Means Of The Segmentation Method, Giuseppe Selli, James L. Drewniak, Richard E. Dubroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean Mccoy, Bruce Archambeault
Power Integrity Investigation Of Bga Footprints By Means Of The Segmentation Method, Giuseppe Selli, James L. Drewniak, Richard E. Dubroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean Mccoy, Bruce Archambeault
Electrical and Computer Engineering Faculty Research & Creative Works
The engineering of the power delivery network is becoming a fundamental issue in the design of high speed digital systems on PCB's. In fact, providing the required power to the different IC's at the specified noisefree voltage levels allows a correct functioning of the overall PCB systems. More over, the ongoing trend of replacing active devices with peripherally located I/O and PWR/GND pins with areally located I/O and PWR/GND pins (BGA packaged) increases the complexity of the models, when power delivery issues need to be studied in a larger contest, such as the overall PCB's. The employment of the powerful, …
Validation Of Circuit Extraction Procedure By Means Of Frequency And Time Domain Measurement, Giulio Antonini, Antonio Ciccomancini Scogna, Antonio Orlandi, Vittorio Ricchiuti, Giuseppe Selli, Shaofeng Luan, James L. Drewniak
Validation Of Circuit Extraction Procedure By Means Of Frequency And Time Domain Measurement, Giulio Antonini, Antonio Ciccomancini Scogna, Antonio Orlandi, Vittorio Ricchiuti, Giuseppe Selli, Shaofeng Luan, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Aim of this paper is the validation in both frequency and time domain of the procedure to extract fully H-Spice compatible equivalent circuits of structures on printed circuit boards. The procedure is initiated by standard measurement of scattering parameters between 40MHz to 20GH. After the extraction of the equivalent circuit, the computed scattering parameters are compared with those measured. The same equivalent circuit is also used for transient analysis in order to compare TDR measurement and eye-pattern to a pseudo-random bit sequence with those coming from the simulations.
Traces In Proximity To Gaps In Return Planes, Todd H. Hubing, Thomas Van Doren, Theodore M. Zeeff
Traces In Proximity To Gaps In Return Planes, Todd H. Hubing, Thomas Van Doren, Theodore M. Zeeff
Electrical and Computer Engineering Faculty Research & Creative Works
Coupling between circuitry on printed circuit boards can be mitigated by a variety of well-known techniques. One such technique is to isolate circuitry in different areas of the printed circuit board by strategically placing a gap in the signal return plane. However, this technique is only effective at reducing common-impedance coupling, which is generally not a significant coupling mechanism at frequencies above 1 MHz. This paper investigates the effect of a gap located between and parallel to adjacent microstrip traces. The effect of the gap on the mutual inductance and mutual capacitance is evaluated. Laboratory measurements and numerical simulations show …
Extracting R, L, G, C Parameters Of Dispersive Planar Transmission Lines From Measured S-Parameters Using A Genetic Algorithm, Jianmin Zhang, Marina Koledintseva, James L. Drewniak, Giulio Antonini, Antonio Orlandi, Konstantin Rozanov
Extracting R, L, G, C Parameters Of Dispersive Planar Transmission Lines From Measured S-Parameters Using A Genetic Algorithm, Jianmin Zhang, Marina Koledintseva, James L. Drewniak, Giulio Antonini, Antonio Orlandi, Konstantin Rozanov
Electrical and Computer Engineering Faculty Research & Creative Works
Signal integrity (SI) analysis of printed circuit boards for high-speed digital design requires information on the perunit-length R, L, G, C parameters of the transmission lines. However, these are not always available when the property of the dielectric medium used in the board is unknown. A method to extract R, L, G, and C parameters from parallel-plate and strip transmission line geometries is proposed. It is based on measured scattering parameters and analytical modeling. A genetic algorithm (GA) is used to optimize the extraction by minimizing the frequency domain discrepancy between an objective function, which is the measured scattering matrix …
Comparison Of Via Equivalent Circuit Model Accuracy Using Quasi-Static And Full-Wave Approaches, Bruce Archambeault, Samuel R. Connor, Jianmin Zhang, James L. Drewniak, Mauro Lai, Antonio Orlandi, Giulio Antonini, Albert E. Ruehli
Comparison Of Via Equivalent Circuit Model Accuracy Using Quasi-Static And Full-Wave Approaches, Bruce Archambeault, Samuel R. Connor, Jianmin Zhang, James L. Drewniak, Mauro Lai, Antonio Orlandi, Giulio Antonini, Albert E. Ruehli
Electrical and Computer Engineering Faculty Research & Creative Works
The EMC and signal integrity impact of printed circuit board (PCB) trace discontinuities, such as vias, where the signal is transitioned from one layer to another in the PCB stackup, have become significant recently with the use of very high speed signals in today''s systems. If these discontinuities are ignored, significant distortion of the high speed signal can occur, and in many cases, cause data errors. A fast and accurate technique to include the effect of via discontinuities in the typical design process is needed to ensure this distortion is considered if significant. Therefore, a simple equivalent circuit for the …
Effects Of Open Stubs Associated With Plated Through-Hole Vias In Backpanel Designs, Shaowei Deng, Jingkun Mao, Todd H. Hubing, James L. Drewniak, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, Chen Wang
Effects Of Open Stubs Associated With Plated Through-Hole Vias In Backpanel Designs, Shaowei Deng, Jingkun Mao, Todd H. Hubing, James L. Drewniak, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, Chen Wang
Electrical and Computer Engineering Faculty Research & Creative Works
Plated through-hole (PTH) vias are commonly used in printed circuit boards. They usually leave open stubs if the signal(s) does not transition the entire depth of the board. These open stubs can have a negative impact on signal transmission. This summary reports the investigation of the impact of the open via stubs in a typical backpanel design.
Expert System Algorithms For Identifying Radiated Emission Problems In Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff, James L. Drewniak, David Pommerenke, R. Kaires
Expert System Algorithms For Identifying Radiated Emission Problems In Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff, James L. Drewniak, David Pommerenke, R. Kaires
Electrical and Computer Engineering Faculty Research & Creative Works
Radiated emission algorithms for a printed circuit board EMC expert system are described. The expert system mimics the thinking processes that human EMC engineers would use to analyze circuit boards and make design recommendations. Working with limited information about the enclosure, cables or the exact nature of the signals, the expert system evaluates different structures on the printed circuit board looking for potentially strong radiated emission sources. Results obtained from the analysis of a sample printed circuit board are provided to demonstrate how the expert system quickly identifies problems that would otherwise be difficult to locate.
Extraction Of A Spice Via Model From Full-Wave Modeling For Differential Signaling, Shaofeng Luan, Giuseppe Selli, James L. Drewniak, Andrea De Luca, Giulio Antonini, Antonio Orlandi, Antonio Ciccomancini Scogna, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander
Extraction Of A Spice Via Model From Full-Wave Modeling For Differential Signaling, Shaofeng Luan, Giuseppe Selli, James L. Drewniak, Andrea De Luca, Giulio Antonini, Antonio Orlandi, Antonio Ciccomancini Scogna, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander
Electrical and Computer Engineering Faculty Research & Creative Works
This paper presents a procedure for building SPICE models for via transitions in differential signaling. The method of extracting parameters of SPICE models from a full-wave simulation tool is demonstrated. Then the validity of the SPICE models is studied by comparing the solution from the SPICE models with that from the full-wave simulation.
Common-Mode Current Due To A Trace Near A Pcb Edge And Its Suppression By A Guard Band, Yoshiki Kayano, Motoshi Tanaka, James L. Drewniak, Hiroshi Inoue
Common-Mode Current Due To A Trace Near A Pcb Edge And Its Suppression By A Guard Band, Yoshiki Kayano, Motoshi Tanaka, James L. Drewniak, Hiroshi Inoue
Electrical and Computer Engineering Faculty Research & Creative Works
The common-mode (CM) current due to a trace near a printed circuit board (PCB) edge, and its suppression by a guard band have been studied experimentally and with finite-difference time-domain (FDTD) modeling. As the guard band, copper tape is connected along the entire edge of the ground plane. First, a PCB electromagnetic interference (EMI) coupling path that results from the nonzero impedance of the PCB ground plane is discussed. As the trace is moved closer to the PCB edge, the CM current increases. Then, the effect of the guard band on the CM current is detailed. A guard band parallel …
Memory Dimm Dc Power Distribution Analysis And Design, Jingkun Mao, Chen Wang, Giuseppe Selli, Bruce Archambeault, James L. Drewniak
Memory Dimm Dc Power Distribution Analysis And Design, Jingkun Mao, Chen Wang, Giuseppe Selli, Bruce Archambeault, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
DC power bus design is critical in meeting signal integrity (SI) and electromagnetic compatibility (EMC) requirements. A suitable modeling tool is beneficial to evaluate power bus design and develop design guidelines. This paper discusses difficulties met in evaluating the power distribution design on a dual inline memory module (DIMM) board, such as a power bus with arbitrary shape, parasitic inductance associated with vias, and so on. Moreover, some solutions are given in this paper. A simple cavity model with a segmentation method was employed to model a power bus with irregular shapes. The partial element equivalent circuit (PEEC) technique was …
Anticipating Emi Using Transfer Functions And Signal Integrity Information, Chen Wang, James L. Drewniak, Jim Nadolny
Anticipating Emi Using Transfer Functions And Signal Integrity Information, Chen Wang, James L. Drewniak, Jim Nadolny
Electrical and Computer Engineering Faculty Research & Creative Works
Discontinuities in a circuit can lead to signal integrity as well as EMI problems. A method, which efficiently combines full-wave tools and circuit simulators, is proposed herein to analyze the coupling at discontinuities. The proposed method may be applied to practical engineering designs.
Modeling Issues For Full-Wave Numerical Emi Simulation, Michael A. Cracraft, Xiaoning Ye, Chen Wang, Sandeep K. R. Chandra, James L. Drewniak
Modeling Issues For Full-Wave Numerical Emi Simulation, Michael A. Cracraft, Xiaoning Ye, Chen Wang, Sandeep K. R. Chandra, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
In electromagnetic modeling, agreement between modeling and measurements is a common goal. There are questions that define every model. What is to be modeled? How is it going to be modeled? At what scale is it to be modeled? Through sample results and discussion, this paper addresses some general and some specific elements of model veracity. Through determination, numerical models can certainly be pushed to match any measured results. However, in the end the question that this paper addresses is not necessarily "How good can this model be?" as it is "Is this model good enough?".
Lumped-Circuit Model Extraction For Vias In Multilayer Substrates, Jun Fan, James L. Drewniak, James L. Knighten
Lumped-Circuit Model Extraction For Vias In Multilayer Substrates, Jun Fan, James L. Drewniak, James L. Knighten
Electrical and Computer Engineering Faculty Research & Creative Works
Via interconnects in multilayer substrates, such as chip scale packaging, ball grid arrays, multichip modules, and printed circuit boards (PCB) can critically impact system performance. Lumped-circuit models for vias are usually established from their geometries to better understand the physics. This paper presents a procedure to extract these element values from a partial element equivalent circuit type method, denoted by CEMPIE. With a known physics-based circuit prototype, this approach calculates the element values from an extensive circuit net extracted by the CEMPIE method. Via inductances in a PCB power bus, including mutual inductances if multiple vias are present, are extracted …
Application Of The Cavity Model To Lossy Power-Return Plane Structures In Printed Circuit Boards, Minjia Xu, Hao Wang, Todd H. Hubing
Application Of The Cavity Model To Lossy Power-Return Plane Structures In Printed Circuit Boards, Minjia Xu, Hao Wang, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Power-return plane pairs in printed circuit boards are often modeled as resonant cavities. Cavity models can be used to calculate transfer impedance parameters used to predict levels of power bus noise. Techniques for applying the cavity model to lossy printed circuit board geometries rely on a low-loss assumption in their derivations. Boards that have been designed to damp power bus resonances (e.g., boards with embedded capacitance) generally violate this low-loss assumption. This paper investigates the validity of the cavity model when applied to printed circuit board structures where the board resonances are significantly damped. Cavity modeling results for sample lossy …
Fdtd Analysis Of Printed Circuit Boards Containing Wideband Lorentzian Dielectric Dispersive Media, Marina Koledintseva, David Pommerenke, James L. Drewniak
Fdtd Analysis Of Printed Circuit Boards Containing Wideband Lorentzian Dielectric Dispersive Media, Marina Koledintseva, David Pommerenke, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
A Lorentzian model as the general case of a frequency-dependent behavior of a dispersive dielectric material is considered in this paper. Recursive convolution algorithms for the finite-difference time-domain (FDTD) technique for two cases of a Lorentzian medium, narrowband and wideband, depending on the ratio of a resonance line half-width at -3 dB and the resonance frequency of the material, are detailed. It is shown that a wideband Lorentzian model of a dielectric FR-4 used in printed circuit boards is more flexible and gives good agreement with experimental curves, and may be preferable as compared to a Debye model.
Application Of Higher-Order Fem Elements To The Analysis Of Microstrip Structures, H. Wang, C. L. Guo, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Application Of Higher-Order Fem Elements To The Analysis Of Microstrip Structures, H. Wang, C. L. Guo, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Microstrip structures, formed by metal traces printed on a dielectric substrate above a reference plane, are frequently the object of electromagnetic modeling. In this paper, hybrid FEM/MoM formulations employing conventional Whitney elements and newly developed linear-tangent/linear-normal (LT/LN) tangential vector finite elements (TVFEs) are applied to the analysis of microstrip structures with thin traces. This paper shows that the variation of the electric field below the trace is a significant issue to be addressed in microstrip structure modeling. Different mesh methods are investigated and the advantages of the LT/LN TVFEs are discussed.
Modeling Noise Coupling From Non-Parallel Pcb Trace Routing, Shaofeng Luan, Fengchao Xiao, W. Liu, Jun Fan, Yoshio Kami, James L. Drewniak, Richard E. Dubroff
Modeling Noise Coupling From Non-Parallel Pcb Trace Routing, Shaofeng Luan, Fengchao Xiao, W. Liu, Jun Fan, Yoshio Kami, James L. Drewniak, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Coupling between PCB signal traces in proximity is of concern to PCB designers and EMC engineers. The behavior of noise coupling between non-parallel microstrip lines is studied in this paper by a full-wave numerical modeling method CEMPIE, designating a circuit extraction approach based on a mixed-potential integral equation formulation. Good agreement between the numerical results and measurements was obtained.
Eye Pattern Evaluation In High-Speed Digital Systems Analysis By Using Mtl Modeling, Giulio Antonini, James L. Drewniak, Antonio Orlandi, Vittorio Ricchiuti
Eye Pattern Evaluation In High-Speed Digital Systems Analysis By Using Mtl Modeling, Giulio Antonini, James L. Drewniak, Antonio Orlandi, Vittorio Ricchiuti
Electrical and Computer Engineering Faculty Research & Creative Works
A method for simulating the eye pattern of high-speed digital signals propagated on printed circuit boards using multiconductor transmission-line modeling is proposed in this paper. The approach takes into account the frequency-dependent properties of the dielectric materials of the board and of the conductors. The validation is performed by comparing the modeling with measurements taken from the literature, and directly performed on test boards specially design for this study.
Extracting Cad Models For Quantifying Noise Coupling Between Vias In Pcb Layouts, Shaofeng Luan, Jun Fan, W. Liu, Fengchao Xiao, James L. Knighten, Norman W. Smith, Ray Alexander, Jim Nadolny, Yoshio Kami, James L. Drewniak
Extracting Cad Models For Quantifying Noise Coupling Between Vias In Pcb Layouts, Shaofeng Luan, Jun Fan, W. Liu, Fengchao Xiao, James L. Knighten, Norman W. Smith, Ray Alexander, Jim Nadolny, Yoshio Kami, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
A method to extract a lumped element prototype SPICE model is used to study noise coupling between non-parallel traces on a PCB. The parameters in this model are extracted using a PEEC-like approach, a Circuit Extraction approach based on a Mixed-Potential Integral Equation formulation (CEMPIE). Without large numbers of unknowns, the SPICE model saves computation time. Also, it is easy to incorporate into system SPICE net list to acquire the system simulation result considering the coupling between traces on the printed circuit board (PCB). A representative case is studied, and the comparison of measurements, CEMPIE simulation, and SPICE modeling are …
Efficient Modeling Of Discontinuities And Dispersive Media In Printed Transmission Lines, R. Araneo, Chen Wang, Xiaoxiong Gu, James L. Drewniak, S. Celozzi
Efficient Modeling Of Discontinuities And Dispersive Media In Printed Transmission Lines, R. Araneo, Chen Wang, Xiaoxiong Gu, James L. Drewniak, S. Celozzi
Electrical and Computer Engineering Faculty Research & Creative Works
The finite-difference time-domain method is applied to the analysis of transmission lines on printed circuit boards. The lossy, dispersive behavior of the dielectric substrate is accurately accounted for by means of several algorithms whose accuracy is discussed and compared. Numerical results are validated by comparisons with measurements and an equivalent circuit of slot in the ground plane is proposed.
Estimating The Power Bus Impedance Of Printed Circuit Boards With Embedded Capacitance, Minjia Xu, Todd H. Hubing
Estimating The Power Bus Impedance Of Printed Circuit Boards With Embedded Capacitance, Minjia Xu, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Embedded capacitance is an alternative to discrete decoupling capacitors and is achieved by enhancing the natural capacitance between closely spaced power and return planes. This paper employs a simple cavity model to investigate the features affecting the power bus impedance of printed circuit boards with embedded capacitance.
Power Bus Isolation Using Power Islands In Printed Circuit Boards, J. Chen, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Power Bus Isolation Using Power Islands In Printed Circuit Boards, J. Chen, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
Power islands are often employed in printed circuit board (PCB) designs to alleviate the problem of power bus noise coupling between circuits. Good isolation can be obtained over a wide frequency band due to the large series impedance provided by the gap between the power islands. However, power bus resonances may degrade the isolation at high frequencies. The amount of isolation also depends on the type of connection between power islands and the components on the board. This paper experimentally investigates the effectiveness of several power island structures up to 3.0 GHz