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Electrical and Computer Engineering
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Full-Text Articles in Engineering
Application Of Higher-Order Fem Elements To The Analysis Of Microstrip Structures, H. Wang, C. L. Guo, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Application Of Higher-Order Fem Elements To The Analysis Of Microstrip Structures, H. Wang, C. L. Guo, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Microstrip structures, formed by metal traces printed on a dielectric substrate above a reference plane, are frequently the object of electromagnetic modeling. In this paper, hybrid FEM/MoM formulations employing conventional Whitney elements and newly developed linear-tangent/linear-normal (LT/LN) tangential vector finite elements (TVFEs) are applied to the analysis of microstrip structures with thin traces. This paper shows that the variation of the electric field below the trace is a significant issue to be addressed in microstrip structure modeling. Different mesh methods are investigated and the advantages of the LT/LN TVFEs are discussed.
Temporal Modeling Of Software Test Coverage, Sahra Sedigh, Arif Ghafoor, Raymond A. Paul
Temporal Modeling Of Software Test Coverage, Sahra Sedigh, Arif Ghafoor, Raymond A. Paul
Electrical and Computer Engineering Faculty Research & Creative Works
This paper presents a temporal model for the coverage achieved by software testing. The proposed model, which is applicable at any level of the testing hierarchy, can determine the value of test coverage at any given time, as well as predicting future values. The model is comprised of two main components: coverage functions, and the coverage matrix. The coverage functions represent the coverage of a single entity as a function of time and reflect the test environment through their stochastic parameters. The coverage matrix utilizes the coverage functions to depict the coverage attained for each entity by each test within …
Extracting Cad Models For Quantifying Noise Coupling Between Vias In Pcb Layouts, Shaofeng Luan, Jun Fan, W. Liu, Fengchao Xiao, James L. Knighten, Norman W. Smith, Ray Alexander, Jim Nadolny, Yoshio Kami, James L. Drewniak
Extracting Cad Models For Quantifying Noise Coupling Between Vias In Pcb Layouts, Shaofeng Luan, Jun Fan, W. Liu, Fengchao Xiao, James L. Knighten, Norman W. Smith, Ray Alexander, Jim Nadolny, Yoshio Kami, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
A method to extract a lumped element prototype SPICE model is used to study noise coupling between non-parallel traces on a PCB. The parameters in this model are extracted using a PEEC-like approach, a Circuit Extraction approach based on a Mixed-Potential Integral Equation formulation (CEMPIE). Without large numbers of unknowns, the SPICE model saves computation time. Also, it is easy to incorporate into system SPICE net list to acquire the system simulation result considering the coupling between traces on the printed circuit board (PCB). A representative case is studied, and the comparison of measurements, CEMPIE simulation, and SPICE modeling are …