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Engineering Commons

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Electrical and Computer Engineering

Electrical and Computer Engineering Faculty Research & Creative Works

1996

Printed Circuit Boards

Articles 1 - 3 of 3

Full-Text Articles in Engineering

Investigation Of Fundamental Emi Source Mechanisms Driving Common-Mode Radiation From Printed Circuit Boards With Attached Cables, David M. Hockanson, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Fei Sha, Michael J. Wilhelm Nov 1996

Investigation Of Fundamental Emi Source Mechanisms Driving Common-Mode Radiation From Printed Circuit Boards With Attached Cables, David M. Hockanson, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Fei Sha, Michael J. Wilhelm

Electrical and Computer Engineering Faculty Research & Creative Works

Fundamental EMI source mechanisms leading to common-mode radiation from printed circuit boards with attached cables are presented in this paper. Two primary EMI source mechanisms have been identified: one associated with a differential-mode voltage and another associated with a differential-mode current, both of which result in a common-mode current on an attached cable. These mechanisms can be used to relate printed circuit layout geometries to EMI sources. The two mechanisms are demonstrated through numerical and experimental results, and an example from a production printed-circuit design is presented.


Simulation And Measurement For Decoupling On Multilayer Pcb Dc Power Buses, Hao Shi, F. Yuan, Fei Sha, James L. Drewniak, Todd H. Hubing, Thomas Van Doren Aug 1996

Simulation And Measurement For Decoupling On Multilayer Pcb Dc Power Buses, Hao Shi, F. Yuan, Fei Sha, James L. Drewniak, Todd H. Hubing, Thomas Van Doren

Electrical and Computer Engineering Faculty Research & Creative Works

DC power bus decoupling of a multi-layer PCB is modeled by a combination of a lumped circuit model at low frequencies ( < 200 MHz), and a mixed-potential integral equation approach at high frequencies. In order to determine the lumped parameters of via interconnects, an effective procedure using a network analyzer has been developed to characterize the trace/via inductances/resistances. For an 8 inch × 10 inch ten-layer test board used in this study, the simulations show good agreement with the measurement. This method can lead to new design strategies of decoupling for multilayer PCB power buses.


Fdtd Modeling Of Common-Mode Radiation From Cables, David M. Hockanson, James L. Drewniak, Todd H. Hubing, Thomas Van Doren Aug 1996

Fdtd Modeling Of Common-Mode Radiation From Cables, David M. Hockanson, James L. Drewniak, Todd H. Hubing, Thomas Van Doren

Electrical and Computer Engineering Faculty Research & Creative Works

Radiation from cables attached to printed circuit boards and shielding enclosures is among the primary concerns in meeting FCC Class A and B limits. The finite-difference time-domain (FDTD) method can be employed to model radiation from printed circuit boards and shielding enclosures with complex geometries, but difficulties in modeling wires and cables of arbitrary radii are encountered. Modeling the wire by setting the axial component of the electric field to zero in the FDTD method results in an effective wire radius that is determined by the mesh discretization. Neglecting the wire radius in applications, such as electromagnetic interference (EMI) or …